轻工机械2024，Vol.42Issue(2)：37-43,49,8.DOI:10.3969/j.issn.1005-2895.2024.02.006
环境应力影响下球栅阵列封装焊球仿真分析与力学性能研究
Simulation and Mechanical Properties of Ball Grid Array Solder Balls under Environmental Stress
祁立鑫 1朱冠政 1陈光耀 1卞康来 1边统帅1
作者信息
- 1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214035
- 折叠
摘要
Abstract
Ball grid array(BGA)was recognized as the main packaging of high-density and high-performance integrated circuits(IC).However,the reliability of tin-lead solder balls could not be further guaranteed under the influence of extreme thermal,corrosion and humid environments.In order to consider the thermal expansion problem caused by temperature changes,the transient viscoplastic strain range of solder balls in BGA circuits under thermal cycling load condition was calculated.Meanwhile,Coffin-Manson empirical equation was used to figure out the cycle number of thermal fatigue through finite element simulation.Besides,quasi-static shear and tensile test had been carried out to analyze the mechanical properties of solder balls after thermal cycling,salt atmosphere and pressure cooker test(PCT)respectively.The cross-section of solder balls were also analyzed by means of scanning electron microscopy(SEM)and energy dispersive spectroscopy(EDS).This research indicates this type of IC has more cycle times than that in appraisement.Furthermore,appropriate accelerated stress test and environmental test condition promote the formation of intermetallic compounds,which enhancing the shear mechanical properties of solder balls effectively.关键词
球栅阵列封装/Sn-Pb焊球/Coffin-Manson经验方程/热疲劳寿命/准静态剪切Key words
BGA(Ball Grid Array)/tin-lead solder ball/Coffin-Manson empirical equation/thermal fatigue life/quasi-static shear分类
信息技术与安全科学引用本文复制引用
祁立鑫,朱冠政,陈光耀,卞康来,边统帅..环境应力影响下球栅阵列封装焊球仿真分析与力学性能研究[J].轻工机械,2024,42(2):37-43,49,8.
