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The Roadmap of 2D Materials and Devices Toward Chips

Anhan Liu Xiaowei Zhang Ziyu Liu Yuning Li Xueyang Peng Xin Li Yue Qin Chen Hu Yanqing Qiu Han Jiang Yang Wang Yifan Li Jun Tang Jun Liu Hao Guo Tao Deng Songang Peng He Tian Tian‑Ling Ren

Nano-Micro Letters2024，Vol.16Issue(6)：P.343-438,96.

Nano-Micro Letters2024，Vol.16Issue(6)：P.343-438,96.DOI:10.1007/s40820-023-01273-5

The Roadmap of 2D Materials and Devices Toward Chips

Anhan Liu ¹Xiaowei Zhang ¹Ziyu Liu ²Yuning Li ³Xueyang Peng ⁴Xin Li ⁵Yue Qin ⁵Chen Hu ⁴Yanqing Qiu ⁴Han Jiang ²Yang Wang ²Yifan Li ¹Jun Tang ⁵Jun Liu ⁵Hao Guo ⁵Tao Deng ³Songang Peng ⁶He Tian ¹Tian‑Ling Ren¹

作者信息

1. School of Integrated Circuits and Beijing National Research Center for Information Science and Technology(BNRist),Tsinghua University,Beijing 100049,People’s Republic of China
2. School of Microelectronics,Fudan University,Shanghai 200433,People’s Republic of China
3. School of Electronic and Information Engineering,Beijing Jiaotong University,Beijing 100044,People’s Republic of China
4. High‑Frequency High‑Voltage Device and Integrated Circuits R&D Center,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,People’s Republic of China School of Integrated Circuits,University of Chinese Academy of Sciences,Beijing 100049,People’s Republic of China
5. State Key Laboratory of Dynamic Measurement Technology,Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement,North University of China,Taiyuan 030051,People’s Republic of China
6. High‑Frequency High‑Voltage Device and Integrated Circuits R&D Center,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,People’s Republic of China IMECAS-HKUST-Joint Laboratory of Microelectronics,Beijing 100029,People’s Republic of China
折叠

摘要

关键词

Two-dimensional materials/Roadmap/Integrated circuits/Post-Moore era

分类

通用工业技术

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Anhan Liu,Xiaowei Zhang,Ziyu Liu,Yuning Li,Xueyang Peng,Xin Li,Yue Qin,Chen Hu,Yanqing Qiu,Han Jiang,Yang Wang,Yifan Li,Jun Tang,Jun Liu,Hao Guo,Tao Deng,Songang Peng,He Tian,Tian‑Ling Ren..The Roadmap of 2D Materials and Devices Toward Chips[J].Nano-Micro Letters,2024,16(6):P.343-438,96.

基金项目

This work was supported in part by STI 2030-Major Projects under Grant 2022ZD0209200,sponsored by Tsinghua-Toyota Joint Research Fund,in part by National Natural Science Foundation of China under Grant 62374099,Grant 62022047,Grant U20A20168,Grant 51861145202,Grant 51821003,and Grant 62175219 （）

in part by the National Key R&D Program under Grant 2016YFA0200400 （）

in part by Beijing Natural Science-Xiaomi Innovation Joint Fund Grant L233009 （）

in part supported by Tsinghua University-Zhuhai Huafa Industrial Share Company Joint Institute for Architecture Optoelectronic Technologies(JIAOT KF202204) （JIAOT KF202204）

in part by the Daikin-Tsinghua Union Program,in part sponsored by CIE-Tencent Robotics X Rhino-Bird Focused Research Program,in part by the Guoqiang Institute,Tsinghua University,in part by the Research Fund from Beijing Innovation Center for Future Chip,in part by Shanxi“1331 Project”Key Subjects Construction,in part by the Youth Innovation Promotion Association of Chinese Academy of Sciences(2019120) （2019120）

the opening fund of Key Laboratory of Science and Technology on Silicon Devices,Chinese Academy of Sciences,in part by the project of MOE Innovation Platform,and in part by the State Key Laboratory of Integrated Chips and Systems. （）

Nano-Micro Letters

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ISSN：2311-6706

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