重庆大学学报2024，Vol.47Issue(4)：94-103,10.DOI:10.11835/j.issn.1000-582X.2024.051
某新型半导体显示产业钢厂房备料区抗震性能分析
Seismic performance analysis of a preparation area with steel structure in the new semiconductor display industry
摘要
Abstract
A nonlinear finite element analysis(FEA)model was proposed to simulate a semiconductor display industrial building equipped with a steel frame brace as a practical engineering case study.The seismic performance of the structure under frequent and rare earthquakes was analyzed.The results show that the overall indexes of the structure meet the requirements of the design codes.However,the inter-story displacement angles of the 3rd and the 6th floors are relatively large.Under rare earthquakes,damage to the members is mainly concentrated in the steel braces.Slight damage occurred in the corner columns at the bottom floor and side beams at middle floors of the structure.The steel braces are shown to effectively improve the structural stiffness and reduce damage to the beams and columns.关键词
钢框架-支撑结构/抗震性能/动力时程分析/结构损伤Key words
steel frame-braced structure/seismic performance/dynamic time analysis/structural damage分类
建筑与水利引用本文复制引用
张兴清,吴明青,祝小凯,樊鹏,杨溥..某新型半导体显示产业钢厂房备料区抗震性能分析[J].重庆大学学报,2024,47(4):94-103,10.基金项目
国家自然科学基金资助项目(52278481).Supported by National Natural Science Foundation of China(52278481). （52278481）
