机电工程技术2024，Vol.53Issue(4)：241-243,302,4.DOI:10.3969/j.issn.1009-9492.2024.04.053
基于强振动环境某封闭电子机柜热设计分析
Thermal Design and Analysis of a Closed Electronic Cabinet Under Strong Vibration
彭伟 1关宏山1
作者信息
- 1. 中国电子科技集团公司第三十八研究所,合肥 230088
- 折叠
摘要
Abstract
In response to the heat dissipation problem of electronic equipment inside a closed electronic cabinet in a strong vibration environment,a thermal structural framework for electronic cabinets with good applicability is proposed.The framework optimizes the design elements of thermal and structural coupling at the bottom of the cabinet,improves the current heat dissipation optimization technology in the strong vibration environment of the closed electronic cabinet.Through the analysis of traditional design problems,the type of thermal design modification form is extracted to avoid the heat sink margin,large volume,and low thermal efficiency of the original technical methods.The characteristics of various aspects are regulated to meet the optimization of engineering thermal design.At the same time,engineering thermal simulation methods are applied to compare and analyze the reliability and accessibility of the thermal performance of this cabinet.The thermal analysis engineering software FloTHERM is used to establish the type close to real working conditions.A three-dimensional calculation model for electronic cabinets is used to analyze the shell edge temperature of components such as bifurcated electronic devices,excitation starters,and measuring circuits in the cabinet from two dimensions of strong vibration environment interference on the outer side of the cabinet and high heat consumption and multiple heat density points on the inner side.It provides structural engineering reference for electronic heat dissipation design under similar working conditions in the future.关键词
电子机柜/强振动/高热耗/多热点Key words
electronic cabinet/strong vibration/high heat consumption/multiple hotspots分类
能源科技引用本文复制引用
彭伟,关宏山..基于强振动环境某封闭电子机柜热设计分析[J].机电工程技术,2024,53(4):241-243,302,4.
