摘要
Abstract
The direct soldering of gold-plated components is easily lead to gold brittle.When the content of gold in the solder alloy is more than 3%,it is obvious that the mechanical strength of the solder joint is greatly reduced,the joint performance becomes brittle and the solder joint is not reliable,there are some quality hidden dangers.Based on the above problems,with more and more localization of gold plating components,de-golding problem becomes more urgent,combined with the reliability requirements of civil aviation products,the research method for civil aviation products through hole components de-golding process parameters is put forward,de-golding time,temperature as dynamic factor in the process parameters after the components to ensure the gold area greater than 95%of the surface designed special tooling,and then de-golding components using element analysis and IMC analysis to verify and test the different process parameters,the optimal gold process parameters is obtained.Through the application and promotion of typical commonly used components,the results show that the obtained de-golding parameters are controllable,feasible and effectively support the assembly process system,which provides a theoretical basis for improving the quality and performance of aviation products.关键词
民用航空产品/通孔元器件/去金工艺/工艺参数Key words
civil aviation products/through hole components/de-golding process/process parameters分类
信息技术与安全科学
