机电工程技术2024，Vol.53Issue(4)：66-70,5.DOI:10.3969/j.issn.1009-9492.2024.04.015
试剂仓半导体制冷模组热端散热器的仿真研究
Simulation of Heat Sink At Hot End of Semiconductor Refrigeration Module In Reagent Bin
摘要
Abstract
The heat dissipation performance of the heat sink at the hot end of the semiconductor refrigeration module will directly affect its refrigeration efficiency,so in the actual work of the semiconductor refrigeration module,the efficient work of the semiconductor refrigeration module is inseparable from the effective heat dissipation mode.To solve this problem,a 3D model is constructed according to the actual situation,and a series of studies are carried out on the hot fin heat sink by using COMSOL®Multiphysics®software simulation and calculation.The simulation results are compared,analyzed and discussed,and the effects of wind velocity,material and fin parameters on heat dissipation performance of the radiator are explored respectively.The results show that the temperature at the hot end decreases with the increase of wind speed;due to the different physical parameters such as heat transfer coefficient,specific heat capacity and density,the heat dissipation performance of different materials with the same structure is very different.The change of fin parameters will change the convective heat transfer process and affect the heat dissipation performance of the radiator.Reasonable reduction of fin height and fin thickness will not significantly reduce the heat dissipation performance while improving the economy of the radiator.The results improve the heat dissipation performance and economy of finned radiator are improved,and then the refrigeration performance of semiconductor refrigeration module is improved,which provides reference for practical engineering application.关键词
半导体制冷/散热器/热端/对流传热Key words
semiconductor refrigeration/heat sink/hot end/convective heat transfer分类
通用工业技术引用本文复制引用
刘威,林方烨,王咏浩,邹继华,谢小恒,邹俊..试剂仓半导体制冷模组热端散热器的仿真研究[J].机电工程技术,2024,53(4):66-70,5.基金项目
中国博士后基金项目(2022M721451) （2022M721451）
浙江省自然科学基金项目(LD22E050003) （LD22E050003）
