铜业工程Issue(2)：45-53,9.DOI:10.3969/j.issn.1009-3842.2024.02.007
引线框架用高性能铜合金板带材及制备工艺
High-Performance Copper Alloy Plate Strip for Lead Frame and Preparation Process
摘要
Abstract
With the rapid development of the electronic information industry,there is a higher demand for the performance of copper and copper alloy products,among which the lead frame material for integrated circuit packaging represents a high level of development of copper alloy plate and strip.In recent years,the high-performance copper alloy strip and its preparation process for lead frame are re-viewed,the material composition,preparation and processing technology and development process of high-performance copper alloy strip at home and abroad are introduced,and the future development trend is prospected.It is proposed that in the future,the perfor-mance of high-performance copper plate and strip will develop towards the goal of IACS with tensile strength of 700MPa and conductivi-ty of 70%,and its preparation process will develop in the direction of intelligence,greening and high efficiency.关键词
集成电路/铜合金/板带材/引线框架/生产工艺Key words
integrated circuit/copper alloy/plate and strip/lead frame/production process分类
矿业与冶金引用本文复制引用
梁海成,高博伦,王松伟,刘劲松,邓偲瀛..引线框架用高性能铜合金板带材及制备工艺[J].铜业工程,2024,(2):45-53,9.基金项目
辽宁省教育厅基本科研项目(LJKMZ20220591)资助 （LJKMZ20220591）
