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基于插片散热器的某功放单元设计

成永昌 郝炎辉 乔雨

现代电子技术2024,Vol.47Issue(10):52-56,5.
现代电子技术2024,Vol.47Issue(10):52-56,5.DOI:10.16652/j.issn.1004-373x.2024.10.010

基于插片散热器的某功放单元设计

Design of power amplifier using fin heat sinks

成永昌 1郝炎辉 1乔雨1

作者信息

  • 1. 中国电子科技集团公司第二十七研究所,河南 郑州 450047
  • 折叠

摘要

Abstract

In order to design a power amplifier that can work under indoor computer room environmental conditions,with a total heat consumption of about 2 700 W,a compact structure,simple heat dissipation method,good heat dissipation effect,and can be installed in a 19 inch cabinet.Based on the working principle of the power amplifier unit,internal device layout,heat consumption,and comprehensive consideration of heat dissipation and structural requirements,a scheme using a combined plug-in heat sink for forced air cooling is designed.By fixing the amplifier module and power supply group on three layered plug-in heat sinks,and forming a complete air duct with the equipment sidewall,the forced air cooling heat dissipation of the amplifier unit is realized.Based on the working principle of the power amplifier unit,internal device layout,heat consumption,and comprehensive consideration of heat dissipation and structural requirements,a design scheme using a combined plug-in heat sink for forced air cooling is designed.The power amplifier module and power supply are installed in groups on three layered heat sinks,and a complete air duct is formed with the equipment sidewall to achieve forced air cooling and heat dissipation of the power amplifier unit.Theoretical calculations of heat conduction and heat dissipation were conducted on the device,and a model was established by the simulation software for numerical analysis.The numerical simulation results show that when the heat exchange of the amplifier unit reaches equilibrium during normal operation,the maximum temperature of the amplifier module casing is 64.2℃,which meets the design requirements.The feasibility of the design scheme of the power amplifier unit based on the combination insert heat sink structure and the rationality and correctness of the calculation and simulation methods are verified by means of the physical prototypes.

关键词

功放/插片散热器/强迫风冷/风冷散热/理论计算/热设计

Key words

power amplifier/insert heat sink/forced air cooling/air cooling and heat dissipation/theoretical calculations/thermal design

分类

电子信息工程

引用本文复制引用

成永昌,郝炎辉,乔雨..基于插片散热器的某功放单元设计[J].现代电子技术,2024,47(10):52-56,5.

现代电子技术

OA北大核心CSTPCD

1004-373X

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