塑料科技2024，Vol.52Issue(4)：75-79,5.DOI:10.15925/j.cnki.issn1005-3360.2024.04.015
具备良好可加工性的聚烯烃类树脂基板的研究
Research on Polyolefin Resin Substrates with Good Processability
高枢健 1冯春明 1金霞 1武聪 1冯贝贝1
作者信息
- 1. 中国电子科技集团公司第四十六研究所,天津 300220
- 折叠
摘要
Abstract
In order to study and improve the processability of polyolefin resin substrates,a polyolefin based substrate product was discussed,and its production process was introduced.The focus was on analyzing the moisture heat resistance,mechanical strength,and electrical properties of the board,analyzing the influencing factors and improvement measures of each performance.The results show that by introducing inorganic fillers(mass ratio 40%～70%)and using 1.5%silane coupling agent to treat the filler interface,the thermal decomposition temperature(weight loss 5%)is at 414.2℃,and the water absorption rate can be reduced to 0.06%,which can improve the moisture heat resistance of the board.Choose an average particle size of 5 μm SiO2 filler,the bending strength is 310 MPa,the peel strength is 0.8 N/mm,and the drilling holes with different apertures have good pore shapes..The content of initiator in the resin system is controlled at around 2.0%,which can ensure that the board has good electrical properties and low CTE for a long time.By optimizing the formula or regulating the process,the indicators of the board can meet the requirements of printed circuit board(PCB)processing and better meet market requirements.关键词
聚烯烃/覆铜板/耐湿热性/力学强度Key words
Polyolefin/Copper clad laminate/Moisture heat resistance/Mechanical strength分类
通用工业技术引用本文复制引用
高枢健,冯春明,金霞,武聪,冯贝贝..具备良好可加工性的聚烯烃类树脂基板的研究[J].塑料科技,2024,52(4):75-79,5.
