太赫兹科学与电子信息学报2024，Vol.22Issue(5)：575-579,5.DOI:10.11805/TKYDA2022228
基于三维异构集成技术的X波段4通道收发模组
X-band four-channel T/R module based on 3D integrated technology
李晓林 1高艳红 1赵宇 1许春良1
作者信息
- 1. 中国电子科技集团公司 第十三研究所,河北 石家庄市 050051
- 折叠
摘要
Abstract
Based on silicon Micro-Electro Mechanical System(MEMS)technology,an X-band four-channel 3D integrated T/R module suitable for array antenna system is designed.The module is stacked by three layers of chips connected to each other by Through Silicon Via(TSV)and Ball Grid Array(BGA).The module integrates functions such as 6-bit digital control phase shifting,6-bit digital control attenuation and serial-to-parallel conversion,negative voltage bias,power modulation.The dimension of the module is 12 mm×12 mm×3.8 mm.The test results show that in the X-band,the saturated transmitting power of the single channel reaches 30 dBm,the gain of transmitting channel reaches 27 dB,the gain of receiving channel reaches 23 dB,the noise figure is less than 1.65 dB.The module bears excellent performance and high integration,which is suitable for mass production.关键词
微系统/T/R模组/三维异构集成/微电子机械系统/硅通孔Key words
microsystem/T/R module/3D heterogeneous integration/Micro-Electro Mechanical System/Through Silicon Via分类
信息技术与安全科学引用本文复制引用
李晓林,高艳红,赵宇,许春良..基于三维异构集成技术的X波段4通道收发模组[J].太赫兹科学与电子信息学报,2024,22(5):575-579,5.
