焊管2024，Vol.47Issue(6)：22-27,6.DOI:10.19291/j.cnki.1001-3938.2024.06.004
激光锡球软钎焊工艺参数对微焊点形态及润湿性的影响
Effect of Laser Solder Ball Soft Brazing Process Parameters on the Morphology and Wettability of Micro Solder Joints
刘标 1李先芬 1柴旭东 1蔡楷 1蒙永民 1华鹏 1徐政1
作者信息
- 1. 合肥工业大学 材料科学与工程学院,合肥 230009
- 折叠
摘要
Abstract
In order to explore the effect of laser solder ball soldering process parameters on the morphology of micro solder joints,laser solder ball soldering was used to prepare micro solder joints on electroless nickel/immersion goldpads with 0.25 mm diameter SAC305 solder balls,and the micro solder joint morphology and SAC305/pad interface wettability were analyzed.The results show that the laser power of 27 W and heating time of 8 ms are the best process parameters,and the micro solder joints prepared by this process parameters are evenly spread on the pads without defects.The height of micro solder joints is negatively correlated with laser power and heating time,and the spread diameter of micro solder joints is positively correlated with laser power and heating time.SAC305/pad interface is flat,and good wettability is at the interface of sprayed SAC305 solder balls/Ni plated Cu pads.关键词
激光锡球焊/SAC305锡球/激光功率/加热时间/焊点形态Key words
laser solder ball soldering/SAC305 solder ball/laser power/heating time/solder joint morphology分类
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刘标,李先芬,柴旭东,蔡楷,蒙永民,华鹏,徐政..激光锡球软钎焊工艺参数对微焊点形态及润湿性的影响[J].焊管,2024,47(6):22-27,6.
