计算机工程与科学2024，Vol.46Issue(6)：977-983,7.DOI:10.3969/j.issn.1007-130X.2024.06.004
面向广义Chiplet的高速BGA与PCB传输结构设计
Design of high-speed BGA and PCB transmission structure for extended Chiplet application
陈天宇 1李川 1王彦辉1
作者信息
- 1. 江南计算技术研究所,江苏 无锡 214083
- 折叠
摘要
Abstract
Aiming at the interconnect design in the extended Chiplet area,the analysis methods and optimization measures of via crosstalk in BGA region are mainly studied.Firstly,modeling&calculat-ing on unit array vias is proposed to evaluate the crosstalk of the whole BGA area vias.Then,a multi-layer fan-out modeling platform is constructed for analysis requirements of different wiring layers.Re-sults from several unit array models and multi-layer fan-out model verify each other,indicating that tak-ing the array unit as the minimum part to evaluate the crosstalk is accurate,and the multi-layer fan-out modeling method is efficient and feasible.PCB vias crosstalk corresponding to two different BGA pin as-signment is analyzed by multi-layer fan-out modeling.Results show that increasing the ratio of spacing between neighboring signal vias to spacing between neighboring signal via and ground via is more effec-tive than increasing the quantity of ground vias or the BGA pitch.关键词
单元阵列/球栅阵列/管脚分配/孔/信号完整性/串扰Key words
unit array/ball grid array(BGA)/pin assignment/via/signal integration/crosstalk分类
信息技术与安全科学引用本文复制引用
陈天宇,李川,王彦辉..面向广义Chiplet的高速BGA与PCB传输结构设计[J].计算机工程与科学,2024,46(6):977-983,7.
