面向广义Chiplet的高速BGA与PCB传输结构设计OA北大核心CSTPCD
Design of high-speed BGA and PCB transmission structure for extended Chiplet application
从广义Chiplet互连设计出发,重点研究BGA区域孔串扰分析方法和优化措施.提出以单元阵列孔建模计算作为全芯片BGA区域孔串扰评估方式,进一步根据不同布线层互连分析需求构建了多层扇出的孔建模平台.单元阵列孔建模分析结果和多层扇出孔阵建模分析结果相互印证,说明以单元阵列作为串扰评估最小单元是准确的,多层扇出孔阵建模方式是高效可行的.采用多层扇出孔阵建模平台对2种BGA封装管脚对应的PCB孔串扰进行了对比分析.结果显示,在封装管脚设计时,提高邻近信…查看全部>>
Aiming at the interconnect design in the extended Chiplet area,the analysis methods and optimization measures of via crosstalk in BGA region are mainly studied.Firstly,modeling&calculat-ing on unit array vias is proposed to evaluate the crosstalk of the whole BGA area vias.Then,a multi-layer fan-out modeling platform is constructed for analysis requirements of different wiring layers.Re-sults from several unit array models and multi-layer fan-out model v…查看全部>>
陈天宇;李川;王彦辉
江南计算技术研究所,江苏 无锡 214083江南计算技术研究所,江苏 无锡 214083江南计算技术研究所,江苏 无锡 214083
计算机与自动化
单元阵列球栅阵列管脚分配孔信号完整性串扰
unit arrayball grid array(BGA)pin assignmentviasignal integrationcrosstalk
《计算机工程与科学》 2024 (6)
977-983,7
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