面向广义Chiplet的高速BGA与PCB传输结构设计OA北大核心CSTPCD

Aiming at the interconnect design in the extended Chiplet area,the analysis methods and optimization measures of via crosstalk in BGA region are mainly studied.Firstly,modeling&calculat-ing on unit array vias is proposed to evaluate the crosstalk of the whole BGA area vias.Then,a multi-layer fan-out modeling platform is constructed for analysis requirements of different wiring layers.Re-sults from several unit array models and multi-layer fan-out model verify each other,indicating that tak-ing the array unit as the minimum part to evaluate the crosstalk is accurate,and the multi-layer fan-out modeling method is efficient and feasible.PCB vias crosstalk corresponding to two different BGA pin as-signment is analyzed by multi-layer fan-out modeling.Results show that increasing the ratio of spacing between neighboring signal vias to spacing between neighboring signal via and ground via is more effec-tive than increasing the quantity of ground vias or the BGA pitch.