首页|期刊导航|西安工程大学学报|化学镀温度对镀银镍粉的微观结构及其性能的影响

化学镀温度对镀银镍粉的微观结构及其性能的影响OACSTPCD

Effects of electroless plating temperatures on microstructure and properties of silver-plated nickel powder

中文摘要英文摘要

为探究在镀银镍粉制备过程中温度对其性能的影响,以硝酸银为银源,Ni颗粒为基材,采用置换-还原化学复合镀法制备镀银镍粉.以粉体为填料,不饱和聚酯树脂为基体,制备导电涂层,并对其导电性和电磁屏蔽性进行测试分析.利用扫描电子显微镜、能谱仪、X射线衍射仪、松装密度测试仪、振实密度测试仪、直流低电阻测试仪等对镀银镍粉微观形貌和宏观特征进行表征与测试分析.结果表明:当化学镀温度为40℃,所制镀银镍粉的Ag层包覆完整、均匀、致密,银的质量分数可达75.01%,粉体的压实电阻可低至293.15 mΩ.粉体松装密度为5.417 g·cm-3,振实密度为5.778 g·cm-3.所制导电涂层的电阻率为4.30 mΩ·cm,电磁屏蔽效能为45.27 dB,具有良好的电磁屏蔽性能.

In order to explore the effects of temperature on the properties of silver-plated nickel powder during its preparation,replacement electroless plating and reduction electroless plating were used to prepare silver-plated nickel powder with silver nitrate as the source of silver and Ni particles as the matrix material.The conductive coating was prepared with powder as filler and unsaturated polyester resin as matrix,and its conductivity and electromagnetic shielding were tested and analyzed.The micro-morphology and macro-characteristics of silver-plated nickel pow-ders were characterized and analyzed by scanning electron microscope,energy dispersive spec-trometer,X-ray diffractometer,apparent density tester,tap density tester and DC Milliohm Me-ter,respectively.Results show that the Ag coating of the prepared silver-plated nickel powder is complete,uniform and compact when the electroless plating temperature is 40℃,and the silver content reachs 75.01%,and its compaction resistance reaches the value 293.15 mΩ.The apparent density and tap density of the powder are 5.417 g·cm-3 and 5.778 g·cm-3,respectively.The obtained coating composite has the resistivity 4.30 mΩ·cm,and the electromagnetic shielding ef-fectiveness is 45.27 dB,which show the good electromagnetic shielding performance.

苏晓磊;张聪聪;刘毅;贾艳;卢琳琳

西安工程大学 材料工程学院,陕西 西安 710048西安工程大学 材料工程学院,陕西 西安 710048西安工程大学 材料工程学院,陕西 西安 710048西安工程大学 材料工程学院,陕西 西安 710048西安工程大学 材料工程学院,陕西 西安 710048

武器工业

银包镍粉化学镀压实电阻率导电涂层电磁屏蔽

silver-plated nickel powderelectroless platingcompaction resistivityconductive coatingelectromagnetic shielding

《西安工程大学学报》 2024 (3)

52-60,9

陕西省教育厅服务地方专项计划项目(23JC036)西安市科技局项目(23KGDW0031-2022)

10.13338/j.issn.1674-649x.2024.03.008

评论