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Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

刘璇

高技术通讯（英文版）2024，Vol.30Issue(2)：170-178,9.

高技术通讯（英文版）2024，Vol.30Issue(2)：170-178,9.DOI:10.3772/j.issn.1006-6748.2024.02.008

Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

刘璇¹

作者信息

折叠

摘要

关键词

finned heat sink/insulated gate bipolar transistor(IGBT)module/heat dissipa-tion/orthogonal test/response surface methodology

Key words

finned heat sink/insulated gate bipolar transistor(IGBT)module/heat dissipa-tion/orthogonal test/response surface methodology

引用本文复制引用

刘璇..Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module[J].高技术通讯（英文版）,2024,30(2):170-178,9.

基金项目

Supported by the National Key Research and Development Plan Program(No.2022YFB4701101),National Natural Science Foundation of Chi-na(No.U1913211)and Natural Science Foundation of Hebei Province of China(No.F2021202062). （No.2022YFB4701101）

高技术通讯（英文版）

ISSN：1006-6748

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