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湿气/热双重固化的聚酰亚胺有机硅涂层OA

Polyimide Silicone Coatings Manufactured by Moisture/Heat Dual Curing

中文摘要英文摘要

以顺丁烯二酸酐、3-氨丙基二甲氧基甲基硅烷为原料,通过缩聚反应,采用一锅法合成了可固化的双马来酰亚胺单体PMI,并和3-(异丁烯酰氧)丙基三甲氧基硅烷通过湿气/热双重固化得到了一系列聚酰亚胺有机硅涂层.固化过程首先是PMI和3-(异丁烯酰氧)丙基三甲氧基硅烷、乙烯基甲基MQ硅树脂在潮湿的环境气氛中通过去乙醇化反应进行半固化,再通过热引发自由基聚合成功地获得了最终涂层.所得的预聚物分子骨架由酰亚胺键组成,产生强氢键和硅氧键,这有利于制备的涂层在极端条件下的稳定性和附着力.考察了涂层的水接触角、表面形貌、附着力及硬度,探究了涂层的交联密度和对固化聚硅氧烷涂层的性能影响.总体而言,制备的涂层具有疏水性、耐湿性、附着力强等特点,在防护领域具有巨大的应用潜力.

Developing coatings with high thermal resistance and strong adhesion is both necessary and challenging.Using maleic anhydride and 3-aminopropyl dimethoxymethylsilane as raw materials,a curable bismaleimide monomer,PMI,was synthesized via a one-pot method.A series of polyimide-silicone coatings were then obtained through a moisture/heat dual-curing process by reacting PMI with 3-(isocyanato)propyl trimethoxysilane.Subsequently,a partial curing process was conducted on PMI and 3-(isocyanato)propyl trimethoxysilane in a humid environment through deethanolization.Finally,the ultimate coating was successfully obtained through thermally initiated free radical polymerization.The resulting pre-polymer molecular skeleton consists of imide bonds,forming strong hydrogen bonds and silicon-oxygen bonds,which contribute to the stability and adhesion of the prepared coating under high-temperature conditions.The coatings were characterized through water contact angle,high-temperature resistance,surface morphology,adhesion,and hardness tests.The impact of crosslinking density on the performance of cured polysiloxane coatings was explored.Overall,the prepared coatings exhibit characteristics such as high-temperature resistance,strong adhesion,and high hardness,showing significant potential in the field of high-temperature protection.

张耀东;黄月文;王峰;刘晖;王彬汁;王斌;谷子琛

中国科学院广州化学研究所 中国科学院新型特种精细化学品工程实验室,广东 广州 510650||中国科学院大学,北京 100049中国科学院广州化学研究所 中国科学院新型特种精细化学品工程实验室,广东 广州 510650||国科广化韶关新材料研究院 国科广化(南雄)新材料研究院有限公司,广东 南雄 512400华中科技大学,湖北 武汉 430074

化学工程

聚酰亚胺有机硅涂层疏水附着力湿气/热双重固化

polyimide-silicone coatinghydrophobicityadhesionmoisture/heat dual-curing

《广州化学》 2024 (003)

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广东省科技专项资金-韶关科技计划项目(210906134536798)

10.16560/j.cnki.gzhx.20240315

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