金刚石与磨料磨具工程2024，Vol.44Issue(3)：335-345,11.DOI:10.13394/j.cnki.jgszz.2023.0275
单颗金刚石磨粒划擦2D SiCf/SiC复合材料实验
Experiment on single diamond abrasive scratching 2D SiCf/SiC composite materials
摘要
Abstract
To reveal the grinding removal mechanism of 2D SiCf/SiC composites,according to the weaving structure characteristics of 2D SiCf/SiC composites,scratching experiments were conducted on the woven surface(WS)and stacking surface(SS)of 2D SiCf/SiC along 0°,45°,and 90° directions.The experiments measured the scratching force and scratching depth and observed the scratching surface morphology.The results show that the removal modes for the SiCf/SiC material on WS0(0° direction of fiber woven surface)are mainly shear,tensile,and bending fracture of longit-udinal fibers(ie.the fiber axis is consistent with the feed rate direction),and shear,bending,and tensile fracture of trans-verse fibers(ie.the fiber axis is perpendicular to the feed rate direction).On WS45(45° direction of fiber woven sur-face),the main removal modes are shear,bending,and tensile fracture.On SS0(0° direction of fiber stacking surface),the main removal modes are extrusion and bending fractures of normal fibers(ie.the fiber axis is perpendicular to the scratching surface),as well as shear,tensile,and bending fractures of longitudinal fibers.On SS90(90° direction of fiber stacking surface),the main removal modes are ductile removal,shear and bending fractur of normal fibers,and shear,bending,and tensile fracture of transverse fibers.Due to the anisotropy of SiC fibers,different directions and fracture modes exhibit varying mechanical properties.Shear fracture requires the least force,while tensile fracture requires the most force.At the same scratch depth,due to the different fracture modes in the WS0,WS45,SS0,and SS90 directions and varying proportions of shear,bending,and tensile fractures,the order of scratch forces is FSS0>FWS45>FSS90>FWS0.When abrasive particles penetrate the composite material,the SiC matrix is peeled off and removed along with crack ex-pansion and mutual penetration.Part of the matrix is removed by compression and then re-scratched by abrasive particles to form ductile scratches.When cutting 2D SiCf/SiC composite materials,it is advisable to choose the WS0 dir-ection and avoid the SS0 direction as much as possible.关键词
单颗金刚石磨粒划擦/SiCf/SiC复合材料/纤维取向/划擦力/表面形貌Key words
single diamond abrasive scratch/SiCf/SiC composite material/fiber orientations/scratching force/surface morphology分类
化学化工引用本文复制引用
王优哲,刘瑶,周扬,李家豪,黎瀚森..单颗金刚石磨粒划擦2D SiCf/SiC复合材料实验[J].金刚石与磨料磨具工程,2024,44(3):335-345,11.基金项目
国家自然科学基金青年基金(51905498) （51905498）
先进制造技术山西省重点实验室开放基金(XJZZ202312). （XJZZ202312）
