| 注册
首页|期刊导航|现代信息科技|面向航空电子产品的电子装联工艺设计系统开发

面向航空电子产品的电子装联工艺设计系统开发

杨昌霖

现代信息科技2024,Vol.8Issue(12):85-90,95,7.
现代信息科技2024,Vol.8Issue(12):85-90,95,7.DOI:10.19850/j.cnki.2096-4706.2024.12.019

面向航空电子产品的电子装联工艺设计系统开发

Development of Process Design System for Electronic Assembly of Avionic Devices

杨昌霖1

作者信息

  • 1. 中国航空工业集团公司西安航空计算技术研究所,陕西 西安 710076
  • 折叠

摘要

Abstract

This paper aims to problems of traditional process design system for electronic assembly,such as the absence of component base and knowledge base,the poor capability of editing image and text,proposes a process design model for electronic assembly,and a process design system for electronic assembly of avionic devices is developed.Furthermore,the system framework,the method of calling data interface and using effects are introduced.The practice indicates that the electronic assembly process design model can provide guiding process information for operators.Through calling data interfaces provided by MFC,various functions could be realized,such as the flexible typeset of images and words,the visualization of process knowledge,file transmission and playing of videos.

关键词

航空电子产品/电子装联/工艺设计系统/MFC

Key words

avionic device/electronic assembly/process design system/MFC

分类

信息技术与安全科学

引用本文复制引用

杨昌霖..面向航空电子产品的电子装联工艺设计系统开发[J].现代信息科技,2024,8(12):85-90,95,7.

现代信息科技

2096-4706

访问量0
|
下载量0
段落导航相关论文