基于内嵌式微通道芯片散热结构设计研究综述OACSTPCD
Review of research on the design of heat dissipation structures based on embedded microchannel chips
电子芯片/系统的尺寸微型化、功能复合化导致了其功率密度的增大,伴随着发热也越来越严重,如何应对电子芯片/系统逐渐增加的热流密度,成为散热设计中面临的巨大挑战,也是当前研究的热点.本文详细论述了传统散热技术的优缺点,对国内外正在开展的内嵌式微通道散热结构进行了系统分析,并着重对基于内嵌式微通道芯片散热技术原理、散热性能和创新性解决方案进行了归纳总结.在分析当前国内外解决方案的基础上,总结了基于内嵌式微通道的芯片散热设计经验和结论,以及面临的挑战,基于此给出了芯片散热设计研究现状和发展方向.
Miniaturization of chip/system dimensions and functional composites have led to an increase in power density,accompanied by the growth in heat generation.Addressing this problem has become a great challenge in thermal design and a current research hotspot.This paper discusses the advantages and disadvantages of traditional heat dissipation techniques,and systematically analyzes the embed-ded microchannel heat dissipation structures at home and abroad.The article focuses on summarizing the principles,thermal perform-ance and innovative solutions of heat dissipation technology based on embedded microchannel chips.Current domestic and international solutions are analyzed,and we summarize the experiences and conclusions of chip thermal design based on embedded microchannels,a-long with the challenges faced.Finally,the current status and future directions of chip thermal design research are presented.
熊园园;刘沛;付予;焦斌斌;芮二明
中国航天标准化与产品保证研究院,北京 100071中国科学院微电子研究所,北京 100029
计算机与自动化
芯片散热内嵌式微通道热流密度散热结构分层复杂歧管
chip heat dissipationembedded microchannelheat flux densityradiator structurethe layered manifold microchannel array structure
《集成电路与嵌入式系统》 2024 (007)
12-18 / 7
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