集成电路与嵌入式系统2024，Vol.24Issue(7)：12-18,7.
基于内嵌式微通道芯片散热结构设计研究综述
Review of research on the design of heat dissipation structures based on embedded microchannel chips
熊园园 1刘沛 1付予 1焦斌斌 2芮二明1
作者信息
- 1. 中国航天标准化与产品保证研究院,北京 100071
- 2. 中国科学院微电子研究所,北京 100029
- 折叠
摘要
Abstract
Miniaturization of chip/system dimensions and functional composites have led to an increase in power density,accompanied by the growth in heat generation.Addressing this problem has become a great challenge in thermal design and a current research hotspot.This paper discusses the advantages and disadvantages of traditional heat dissipation techniques,and systematically analyzes the embed-ded microchannel heat dissipation structures at home and abroad.The article focuses on summarizing the principles,thermal perform-ance and innovative solutions of heat dissipation technology based on embedded microchannel chips.Current domestic and international solutions are analyzed,and we summarize the experiences and conclusions of chip thermal design based on embedded microchannels,a-long with the challenges faced.Finally,the current status and future directions of chip thermal design research are presented.关键词
芯片散热/内嵌式微通道/热流密度/散热结构/分层复杂歧管Key words
chip heat dissipation/embedded microchannel/heat flux density/radiator structure/the layered manifold microchannel array structure分类
信息技术与安全科学引用本文复制引用
熊园园,刘沛,付予,焦斌斌,芮二明..基于内嵌式微通道芯片散热结构设计研究综述[J].集成电路与嵌入式系统,2024,24(7):12-18,7.
