集成电路与嵌入式系统2024，Vol.24Issue(7)：19-24,6.
基于质量保证前移的TSV硅转接板检验评价方法
Quality and reliability evaluation methods for TSV silicon interposers based on assurance forward movement
刘莹莹 1刘沛 1付琬月 1付予 1张立康1
作者信息
- 1. 中国航天标准化与产品保证研究院,北京 100071
- 折叠
摘要
Abstract
As one of the most advanced new high-density packaging processes,TSV has an extremely complex structural process.Cur-rently,there are few quality inspection and reliability evaluation methods for large-scale applications and engineering applications in China,and relevant unified standards have not been fully established.This paper focuses on TSV silicon interposers in 2.5D packaging,which are the relatively mature and reach the industry consensus.Combining its process structure characteristics and front-line data from actual product production testing,the quality inspection method and the reliability evaluation method for TSV silicon interposers based on the forward movement of quality assurance are studied.A mature solution is established for the process quality monitoring,inspec-tion evaluation,reliability assurance,and the establishment of related standards and specifications for TSV process products.关键词
TSV/硅转接板/质量检验/可靠性评价/2.5D封装Key words
TSV/silicon interposer/quality inspection/reliability evaluation/2.5D packaging分类
信息技术与安全科学引用本文复制引用
刘莹莹,刘沛,付琬月,付予,张立康..基于质量保证前移的TSV硅转接板检验评价方法[J].集成电路与嵌入式系统,2024,24(7):19-24,6.
