基于质量保证前移的TSV硅转接板检验评价方法OACSTPCD

As one of the most advanced new high-density packaging processes,TSV has an extremely complex structural process.Cur-rently,there are few quality inspection and reliability evaluation methods for large-scale applications and engineering applications in China,and relevant unified standards have not been fully established.This paper focuses on TSV silicon interposers in 2.5D packaging,which are the relatively mature and reach the industry consensus.Combining its process structure characteristics and front-line data from actual product production testing,the quality inspection method and the reliability evaluation method for TSV silicon interposers based on the forward movement of quality assurance are studied.A mature solution is established for the process quality monitoring,inspec-tion evaluation,reliability assurance,and the establishment of related standards and specifications for TSV process products.