集成电路与嵌入式系统2024，Vol.24Issue(7)：25-29,5.
高密度混合电路封装技术发展趋势及可靠性评价方法研究
Research on the development trend and reliability evaluation method of high-density hybrid circuit packaging technology
吉美宁 1常明超 1贾子健 1马保梁 1王锦 1董浩威 1范壮壮1
作者信息
摘要
Abstract
The evolution of electronic products towards miniaturization and intelligence is an inevitable development trend.High-density integrated circuit packaging technology is a key technology to achieve miniaturization of the product.In this paper,the packaging tech-nology of high-density hybrid integrated circuit is studied.The packaging design of high-density hybrid integrated circuit is discussed from the aspects of substrate selection,structure design and heat dissipation design.On this basis,combined with the reliability require-ments for non-hermetic hybrid integrated circuits,the article further studies the reliability evaluation method of high-density and non-hermetic hybrid integrated circuits.The effectiveness of the evaluation method is illustrated through practical examples.It can be used as a reference for the quality assurance system construction of domestic non-hermetic integrated circuits.关键词
混合集成电路/封装技术/可靠性评价/双列直插封装/无引脚芯片载体封装Key words
hybrid integration circuit/packaging technology/reliability evaluation/DIP/LCC分类
信息技术与安全科学引用本文复制引用
吉美宁,常明超,贾子健,马保梁,王锦,董浩威,范壮壮..高密度混合电路封装技术发展趋势及可靠性评价方法研究[J].集成电路与嵌入式系统,2024,24(7):25-29,5.
