高密度混合电路封装技术发展趋势及可靠性评价方法研究OACSTPCD

The evolution of electronic products towards miniaturization and intelligence is an inevitable development trend.High-density integrated circuit packaging technology is a key technology to achieve miniaturization of the product.In this paper,the packaging tech-nology of high-density hybrid integrated circuit is studied.The packaging design of high-density hybrid integrated circuit is discussed from the aspects of substrate selection,structure design and heat dissipation design.On this basis,combined with the reliability require-ments for non-hermetic hybrid integrated circuits,the article further studies the reliability evaluation method of high-density and non-hermetic hybrid integrated circuits.The effectiveness of the evaluation method is illustrated through practical examples.It can be used as a reference for the quality assurance system construction of domestic non-hermetic integrated circuits.