集成电路与嵌入式系统2024，Vol.24Issue(7)：37-42,6.
基于有限元分析的扇出型晶圆级封装组装工艺热循环仿真评价
Thermal simulation assessment of assembly process of fan-out wafer level oackaae based on finite element analysis
李培蕾 1张伟 1贾秋阳 1姜贸公 1谷瀚天1
作者信息
- 1. 中国航天宇航元器件工程中心,北京 100094
- 折叠
摘要
Abstract
This paper evaluates the thermal reliability of assembly process of Fan-out Wafer Level Package based on simulation.Firstly,we briefly introduce the critical technologies of Fan-out wafer level package and analyze the possible failure mechanism of these advanced packaging technologies.Then,for a typical package structure based on Fan-out wafer level package technology,the 1/4 structure finite element model is established.The simulation of the critical structure under the typical military thermal cycling condition is conducted.By analyzing the stress and displacement of the key structures of the package,potential reliability vulnerabilities leading to failure of fan-out wafer-level packaging have been identified.关键词
晶圆级封装/可靠性/热循环/有限元分析/穿透硅通孔Key words
wafer level package/reliability/thermal cycling/finite element analysis/TSV分类
电子信息工程引用本文复制引用
李培蕾,张伟,贾秋阳,姜贸公,谷瀚天..基于有限元分析的扇出型晶圆级封装组装工艺热循环仿真评价[J].集成电路与嵌入式系统,2024,24(7):37-42,6.
