集成电路微组装用环氧粘接胶树脂析出及控制研究OACSTPCD

The use of epoxy adhesive die attach material in integrated circuits is gaining popularity.Die attach epoxy adhesive resin bleed is commonly observed during the curing process.A reliability issue for wirebonding will occur if the material spreads over an area where wirebonding is to be performed.In this paper,an approach involving contact angle measurement is used to determine the mechanism of resin bleed.In addition,the effect of roughness of the substrate on resin bleed is also discussed.Priliminary results suggest that vacuum baking plays a significant role in resin bleed while no correlation was seen with roughness of substrate.