集成电路与嵌入式系统2024，Vol.24Issue(7)：48-51,4.
集成电路微组装用环氧粘接胶树脂析出及控制研究
An experimental study of die attach epoxy adhesive resin bleed in integrated circuits
谢廷明 1廖希异 1谢换鑫 1林杨柳1
作者信息
- 1. 中国电子科技集团公司第二十四研究所,重庆 400060
- 折叠
摘要
Abstract
The use of epoxy adhesive die attach material in integrated circuits is gaining popularity.Die attach epoxy adhesive resin bleed is commonly observed during the curing process.A reliability issue for wirebonding will occur if the material spreads over an area where wirebonding is to be performed.In this paper,an approach involving contact angle measurement is used to determine the mechanism of resin bleed.In addition,the effect of roughness of the substrate on resin bleed is also discussed.Priliminary results suggest that vacuum baking plays a significant role in resin bleed while no correlation was seen with roughness of substrate.关键词
树脂析出/基板粗糙度/接触角/真空烘培/等离子清洗Key words
resin bleed/roughness of the substrate/contact angles/vacuum baking/plasma cleaning分类
信息技术与安全科学引用本文复制引用
谢廷明,廖希异,谢换鑫,林杨柳..集成电路微组装用环氧粘接胶树脂析出及控制研究[J].集成电路与嵌入式系统,2024,24(7):48-51,4.
