|国家科技期刊平台
首页|期刊导航|华中科技大学学报(自然科学版)|基于LHP的数据中心服务器芯片级散热技术

基于LHP的数据中心服务器芯片级散热技术OA北大核心CSTPCD

Server chip-level cooling technology in data center based on LHP

中文摘要英文摘要

针对绿色数据中心的高效散热和节能降耗需求,开展了基于环路热管的数据中心服务器芯片级散热技术研究,完成了高性能环路热管在真实服务器上的应用开发和不同冷端温度条件下的测试实验.实验结果显示:在相同测试条件下,液冷式环路热管对服务器芯片的控温值比传统翅片热沉结构降低29~32℃,风冷式环路热管对服务器芯片的控温值比传统翅片热沉结构降低29~30℃,为提高数据中心的供水温度和送风温度而降低数据中心制冷能耗创造了条件.采用环路热管芯片级散热技术的服务器整机噪声值降低25~30 dB,改善了机房内人机环境的友好性.

To solve the needs of high-efficiency heat dissipation and energy conservation for green data centers,an investigation about the server chip-level cooling technology in data center based on loop heat pipe(LHP)was explored.The high performance LHPs applied in real servers and their application tests at varied condenser temperature were initiatively developed and experimented.The experimental results show that,compared to traditional fin-heat-sinks working at the same test conditions,the water-cooling LHP can decrease the case temperature of server chips about 29~32℃and the air-cooling LHP can reduce the case temperature of server chips about 29~30℃.These conclusions are helpful to increase the temperature of supply water and supply wind in data center,which makes a possibility of cutting down the energy use of cooling system dramatically in data center.Meanwhile,the noise value of whole server by using LHP chip-level cooling can decrease about 25~30 dB,which is beneficial for the friendliness of man-machine environment.

薛志虎;艾邦成;曲伟

中国航天空气动力技术研究院,北京 100074

能源与动力

数据中心服务器电子散热芯片级节能环路热管

data centerserverelectronic coolingchip-levelenergy conservationloop heat pipe

《华中科技大学学报(自然科学版)》 2024 (007)

126-131 / 6

国家自然科学基金资助项目(U21B2051);中国航天科技集团自主创新研发项目(YGKT20161404).

10.13245/j.hust.240339

评论