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基于HTO的LDMOS器件结构及其热载流子注入退化研究

邵红 李永顺 宋亮 金华俊 张森

电子学报2024,Vol.52Issue(5):1582-1590,9.
电子学报2024,Vol.52Issue(5):1582-1590,9.DOI:10.12263/DZXB.20230025

基于HTO的LDMOS器件结构及其热载流子注入退化研究

Research on HTO-Based LDMOS Device Structure and Its Hot Carrier Injection Degradation

邵红 1李永顺 1宋亮 1金华俊 1张森1

作者信息

  • 1. 无锡华润上华科技有限公司器件工程部,江苏无锡 210041
  • 折叠

摘要

Abstract

In order to meet the market demand of medium and low voltage consumer electronics,the small size and high density Bipolar-CMOS-DMOS technology has been vigorously developed.Low loss and high reliability have become the focus and difficulty in the design of lateral double-diffused metal-oxide-semiconductor field effect transistors in Bipolar-CMOS-DMOS technology.This paper introduces a lateral double-diffused metal-oxide-semiconductor field effect transis-tor based on the high temperature oxidation layer structure,and studies and analyzes the degradation mechanism of its hot carrier injection.The high temperature oxidation layer structure is used to improve the traditional shallow trench isolation structure,in which the oxide steps embedded in the semiconductor have adverse effects on the hot carrier injection of the de-vice.Thus improve the reliability of the device.The proposed structure shortens the current path length in the on state of the device and reduces the loss.In addition,this paper also proposes a self-aligned implantation process optimization meth-od for the P-type body region.By increasing the implantation process of the high-energy body region,the depletion region in the accumulation area is expanded,the surface electric field of the drift region is reduced,and the breakdown voltage is improved.The proposed HTO-LDMOS has a breakdown voltage of 43 V,a specific on-resistance of 9.5 mΩ·mm2,and a linear region current degradation of 0.87%after 10 000 s.

关键词

横向双扩散金属氧化物半导体场效应管/热载流子注入/高温氧化层/低损耗/高可靠性

Key words

lateral double-diffused metal-oxide-semiconductor field effect transistor/hot carrier injection/high tem-perature oxidation layer/low loss/high reliability

分类

信息技术与安全科学

引用本文复制引用

邵红,李永顺,宋亮,金华俊,张森..基于HTO的LDMOS器件结构及其热载流子注入退化研究[J].电子学报,2024,52(5):1582-1590,9.

电子学报

OA北大核心CSTPCD

0372-2112

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