机械科学与技术2024，Vol.43Issue(6)：1048-1055,8.DOI:10.13433/j.cnki.1003-8728.20240080
利用双磁极平面磁力研磨法对单晶硅表面的抛光实验研究
Studyon Polishing Experiment of Single Crystal Silicon Surface by Using Dual-pole Planar Magnetic Abrasive Finishing Method
摘要
Abstract
The dual-pole magnetic abrasive finishing method(DMAF)is proposed for the surface planarization of single crystal silicon,and a set of dual-pole magnetic abrasive finishing device is designed.The processing mechanism of DMAF is explored,the effects of the key machining parameters on the surface quality of single crystal silicon is clarified and the machining parameters through single-factor comparative experimentsis optimized.By using ANSYS MAXWELL finite element software to simulate the magnetic field intensities in both traditional planar magnetic abrasive finishing method and DMAF,the magnetic induction intensity in the finishing area produced in two different finishing methods were compared to obtain the quantitative analysis of the finishing pressure of magnetic abrasive particles.According to the results of single-factor experiments,the optimizedpolishing parameters obtained in DMAF of the surface polishing of single crystal silicon wafers were in the following:the abrasive combination of#200Fe3O4+#8000WA,the gap of magnetic poles at 12 mm,magnetic pole speed at 300 r/min,and abrasive mass ratio at 3:1.It was indicated in the experimental results that with the optimal machining parameters,the single crystal silicon wafers reached their average surface roughness as low as 8 nm from the initial 0.578 μm after 60 min finishing,and the workpiecein the polishing area almost achieveda mirror finishing effect.The simulation results show that comparing with the traditional plane magnetic abrasive finishing method,the DMAF can significantly improve the magnetic field intensity of the processing area,and the intensity produced in DMAF is about 1.5 times that in the traditional magnetic finishing method.关键词
双磁极磁力研磨法/单晶硅/表面平坦化/研磨参数/磁感应强度/表面粗糙度Key words
dual-pole magnetic abrasive finishing method/single crystal silicon/surfaceplanarization/polishing parameters/magnetic induction strength/surface roughness分类
矿业与冶金引用本文复制引用
杨燕珍,孙旭,李嘉旸,邹世清,傅永建..利用双磁极平面磁力研磨法对单晶硅表面的抛光实验研究[J].机械科学与技术,2024,43(6):1048-1055,8.基金项目
福建省自然科学基金项目(2023J01971,2022J011148)与福建省教育厅中青年项目(JAT220371) （2023J01971,2022J011148）
