首页|期刊导航|半导体学报(英文版)|Current-collapse suppression and leakage-current decrease in AlGaN/GaN HEMT by sputter-TaN gate-dielectric layer

Current-collapse suppression and leakage-current decrease in AlGaN/GaN HEMT by sputter-TaN gate-dielectric layerOACSTPCDEI

Current-collapse suppression and leakage-current decrease in AlGaN/GaN HEMT by sputter-TaN gate-dielectric layer

Bosen Liu;Lu Wang;Qizhi Huang;Leifeng Jiang;Zhongming Zeng;Zhipeng Wei;Baoshun Zhang;Guohao Yu;Huimin Jia;Jingyuan Zhu;Jiaan Zhou;Yu Li;Bingliang Zhang;Zhongkai Du;Bohan Guo

State Key Laboratory of High-Power Semiconductor Laser,School of Physics,Changchun University of Science and Technology,Changchun130022,China||Nanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,ChinaState Key Laboratory of High-Power Semiconductor Laser,School of Physics,Changchun University of Science and Technology,Changchun130022,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,ChinaState Key Laboratory of High-Power Semiconductor Laser,School of Physics,Changchun University of Science and Technology,Changchun130022,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,China||Suzhou Powerhouse Electronics Technology Co.,Ltd.,Suzhou 215123,ChinaState Key Laboratory of High-Power Semiconductor Laser,School of Physics,Changchun University of Science and Technology,Changchun130022,ChinaState Key Laboratory of High-Power Semiconductor Laser,School of Physics,Changchun University of Science and Technology,Changchun130022,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,ChinaSuzhou Powerhouse Electronics Technology Co.,Ltd.,Suzhou 215123,ChinaSuzhou Powerhouse Electronics Technology Co.,Ltd.,Suzhou 215123,ChinaNanofabrication facility,Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou 215123,China

AlGaN/GaN MIS HEMTsgate dielectric layerdepletion-modegate reliabilityIon/Ioff ratio

AlGaN/GaN MIS HEMTsgate dielectric layerdepletion-modegate reliabilityIon/Ioff ratio

《半导体学报(英文版)》 2024 (7)

69-75,7

This work was supported by the National Natural Science Foundation of China(Grant No.1237310),The Youth Innovation Promotion Association of the Chinese Academy of Sciences(Grant No.2020321),the National Natural Science Foundation of China(Grant No.92163204),The Key Research and Development Program of Jiangsu Province(Grant No.BE2022057-1).The authors would like to thank the Nano Fabrication Facility,Platform for Characterization and Test,Vacuum Interconnected Nanotech Workstation(NANO-X),and Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences.

10.1088/1674-4926/24010025

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