电焊机2024，Vol.54Issue(7)：62-67,6.DOI:10.7512/j.issn.1001-2303.2024.07.09
Cu箔缓冲层对SiO2/TC4接头组织性能的影响
Microstructure and Properties of SiO2/TC4 Brazed Joint with Cu Buffer Layer
摘要
Abstract
The brazing joint of quartz glass/TC4 titanium alloy was brittle.to solve this problem,The vacuum brazing of quartz glass/AgCuTi/TC4 titanium alloy was carried out by adding Cu buffer layer in the weld.The effects of Cu buffer layer and different brazing processes on the microstructure and mechanical properties of SiO2/TC4 joint were analyzed.The results shows that:At the right brazing temperature,The addition of Cu buffer layer can form TiSi2+Ti4O7/Cu2Ti4O at the in-terface of SiO2/AgCuTi,and form a large amount of Cu solid solution in the weld,which can reduce the residual stress of the joints,and then improve the mechanical properties of the brazed joint.When the brazing temperature is 900℃ and the hold-ing time is 10 min,the shear strength of the brazed joint with Cu buffer layer is the highest,reaching 38 MPa.关键词
石英玻璃/TC4钛合金/Cu箔缓冲层/固溶体/应力Key words
quartz glass/TC4 titanium alloy/Cu buffer layer/solid solution/stress分类
矿业与冶金引用本文复制引用
薛行雁,龚浩,程东海,王东亮,潘建军..Cu箔缓冲层对SiO2/TC4接头组织性能的影响[J].电焊机,2024,54(7):62-67,6.基金项目
国家重点研发计划(2022YFB3402204) （2022YFB3402204）
