红外技术2024，Vol.46Issue(7)：821-825,5.
基于微结构的红外焦平面芯片MTF测试
MTF Testing of Infrared Focal Plane Array Based on Microstructures
张应旭 1李培源 1司洋 1姚亮亮 2赵鹏 1袁绶章 1殷慧 1李雄军1
作者信息
- 1. 昆明物理研究所,云南 昆明 650223
- 2. 陆军装备部驻重庆地区军事代表局驻昆明地区第一军代室,云南 昆明 650223
- 折叠
摘要
Abstract
The modulation transfer function(MTF)is an important parameter for evaluating the imaging ability of an infrared focal plane(FPA)for targets with different spatial frequencies.The MTF of the focal plane is affected by the size of the photosensitive area of the pixel,center distance of the pixel,and carrier diffusion length.As the number of pixels decreases,the influence of the carrier diffusion length on the MTF becomes more evident.In this study,a convenient and accurate MTF testing method was designed to meet the requirements of MTF testing for hybrid FPA.A special microstructure was fabricated on the focal plane through metal deposition,photolithography,and other processes to replace the inclined knife edge.The MTF of the FPA was obtained by the proposed infrared focal-plane test method.The results demonstrate that the MTF of the FPA can be measured accurately and conveniently using this method,which is convenient for FPA production and development companies to evaluate the FPA performance and verify device fabrication quickly.关键词
红外焦平面/调制传递函数/倾斜刀口法/微结构Key words
infrared focal plane/MTF/tilted edge method/microstructure分类
电子信息工程引用本文复制引用
张应旭,李培源,司洋,姚亮亮,赵鹏,袁绶章,殷慧,李雄军..基于微结构的红外焦平面芯片MTF测试[J].红外技术,2024,46(7):821-825,5.
