红外与毫米波学报2024，Vol.43Issue(3)：356-360,5.DOI:10.11972/j.issn.1001-9014.2024.03.009
基于4.3 THz量子级联激光器的微米级无损厚度测量
Non-destructive thickness measurement with micron level accuracy based on a 4.3-THz quantum-cascade laser
摘要
Abstract
A homodyne detection system to acquire the thickness of silicon wafers is constructed and described.By harnessing the relationship between the transmission phase change of a 4.3-THz light beam and the incident an-gle controlled by a mechanical rotating stage,the thickness value of sample can be precisely deduced using the standard residual error method.The results indicate that the fitted thickness of the sample differs by only 2.5～3 μm from more accurate results measured by optical microscopes,achieving terahertz non-destructive thickness measurement with micron level accuracy.The experiment validates the effectiveness of terahertz quantum-cas-cade laser in non-contact and nondestructive measurement.关键词
太赫兹/量子级联激光器/零差探测/无损检测/非接触测量Key words
terahertz/quantum-cascade laser/homodyne detection/non-destructive testing/non-contact measurement分类
信息技术与安全科学引用本文复制引用
李弘义,谭智勇,万文坚,曹俊诚..基于4.3 THz量子级联激光器的微米级无损厚度测量[J].红外与毫米波学报,2024,43(3):356-360,5.基金项目
Supported by the National Natural Science Foundation of China(61927813,62035014,62275258),and Science and Technology Com-mission of Shanghai Municipal(21ZR1474600). （61927813,62035014,62275258）
