基于4.3 THz量子级联激光器的微米级无损厚度测量OA北大核心CSTPCD
Non-destructive thickness measurement with micron level accuracy based on a 4.3-THz quantum-cascade laser
构建和描述了一种用于获取硅片厚度的零差检测系统.利用4.3-THz激光束的传输相变与机械旋转台控制的入射角之间的关系,可以使用标准残差法精确推导被测样品的厚度值.结果表明,样品的厚度拟合值与光学显微镜的精确测量结果仅相差2.5～3 μm,实现了微米级精度的太赫兹无损厚度测量.实验验证了太赫兹量子级联激光器在非接触无损测量中的有效性.
A homodyne detection system to acquire the thickness of silicon wafers is constructed and described.By harnessing the relationship between the transmission phase change of a 4.3-THz light beam and the incident an-gle controlled by a mechanical rotating stage,the thickness value of sample can be precisely deduced using the standard residual error method.The results indicate that the fitted thickness of the sample differs by only 2.5～3 μm from more accurate results measured by optical microscopes,achieving terahertz non-destructive thickness measurement with micron level accuracy.The experiment validates the effectiveness of terahertz quantum-cas-cade laser in non-contact and nondestructive measurement.
李弘义;谭智勇;万文坚;曹俊诚
中国科学院上海微系统与信息技术研究所,集成电路材料全国重点实验室,上海 200050||中国科学院大学材料科学与光电工程中心,北京 100049
电子信息工程
太赫兹量子级联激光器零差探测无损检测非接触测量
terahertzquantum-cascade laserhomodyne detectionnon-destructive testingnon-contact measurement
《红外与毫米波学报》 2024 (003)
356-360 / 5
Supported by the National Natural Science Foundation of China(61927813,62035014,62275258),and Science and Technology Com-mission of Shanghai Municipal(21ZR1474600).
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