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电解铜粉添加剂的研究现状与展望

殷亚坤 韩山玉 夏文堂 石雯 王泽龙 杨梅 杨文强

铜业工程Issue(3):110-118,9.
铜业工程Issue(3):110-118,9.DOI:10.3969/j.issn.1009-3842.2024.03.010

电解铜粉添加剂的研究现状与展望

Research Status and Prospect of Additives for Electrolytic Copper Powder

殷亚坤 1韩山玉 1夏文堂 2石雯 1王泽龙 1杨梅 1杨文强2

作者信息

  • 1. 重庆科技大学冶金与材料工程学院,重庆 401331
  • 2. 重庆科技大学冶金与材料工程学院,重庆 401331||复杂金属矿产资源增值处理与清洁提取重庆高校重点实验室,重庆 401331
  • 折叠

摘要

Abstract

Electrolytic copper powder,with its distinctive physicochemical traits and unique dendritic configuration,is an indispens-able fundamental material in high-end manufacturing and advanced material synthesis.However,the preparation of electrolytic copper powder through the modification of conventional process parameters confronts challenges including high energy consumption,dimin-ished production efficiency,excessively coarse and bulky products,and narrow parametric control windows.The strategic application and optimization of additives in the electrolyte have emerged as a crucial strategy for improving the manufacturing process of electrolyt-ic copper powder.These additives can efficiently regulate the electrochemical reaction process,modify the copper powder's morpholo-gy,and enhance its performance.This review thoroughly discussed the roles of various additives-cationic,anionic,non-ionic,and am-photeric in the preparation of electrolytic copper powder,exploring the synergistic effect among them and its impact on the powder's morphology and performance.Additionally,this review highlighted current challenges and emerging trends in applying these additives.The comprehensive analysis of the additives in this study could serve as a reference for selecting suitable additives,optimizing electrol-ysis processes,increasing product performance,and discovering new applications for electrolytic copper powder.

关键词

添加剂/电解铜粉/形貌/协同作用

Key words

additives/electrolytic copper powder/morphology/synergistic effect

分类

矿业与冶金

引用本文复制引用

殷亚坤,韩山玉,夏文堂,石雯,王泽龙,杨梅,杨文强..电解铜粉添加剂的研究现状与展望[J].铜业工程,2024,(3):110-118,9.

基金项目

国家自然科学基金面上项目(52174331) (52174331)

重庆市教委科学技术研究项目(KJQN202201529) (KJQN202201529)

重庆市博士"直通车"研究项目(CSTB2022BSXM-JCX0137) (CSTB2022BSXM-JCX0137)

重庆科技大学硕士研究生创新计划项目(YKJCX2220211)资助 (YKJCX2220211)

铜业工程

1009-3842

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