航天器环境工程2024，Vol.41Issue(4)：430-438,9.DOI:10.12126/see.2023153
一种低成本相变材料热沉的设计与仿真
Design and simulation of a low-cost PCM heat sink
方进晖 1刘浩 1林佳 1余宏坤1
作者信息
- 1. 中国电子科技集团第二十九研究所,成都 610036
- 折叠
摘要
Abstract
Due to the high cost of composite phase change heat sink in existing electronic devices,a low-cost and light-weight phase change materials(PCM)heat sink design was proposed,in which the thermal beads were only arranged in the main heat conduction direction,and the specific surface area was increased by drilling holes.For the PCM heat sink of an electronic device module,the influence of the thickness,arrangement along the heat transfer path,the perforation diameter and porosity of the thermal beads,on the heat transfer were designed and simulated.Compared with the 8%expanded graphite-high-carbon alcohol composite PCM heat sink,the proposed PCM heat sink has little effect on the chip temperature in the noncritical junction temperature state in that the temperature difference does not exceed 3.2℃,and the mass increases by only 5%.In addition,the cost is only one-third of the composite phase change heat sink.The research may provide a way for the PCM heat sinks to reduce their cost and popularize their use.关键词
电子设备/热管理/相变材料热沉/低成本设计Key words
electronic device/thermal management/PCM heat sink/low-cost design分类
能源科技引用本文复制引用
方进晖,刘浩,林佳,余宏坤..一种低成本相变材料热沉的设计与仿真[J].航天器环境工程,2024,41(4):430-438,9.
