红外技术2024，Vol.46Issue(8)：879-882,4.
中波红外640×512(25μm)探测器组件可靠性验证试验
Reliability Verification Test of Mid-Wave Infrared 640×512(25 μm)Detector Assembly
宋宏伟 1刘塑 2李海英 2于洪有 1史圣兵 1郭秀丽 3李昊岚 2张亚平 2王向前2
作者信息
- 1. 中国人民解放军63863部队,吉林 白城 137001
- 2. 昆明物理研究所,云南 昆明 650217
- 3. 中国人民解放军32397部队,吉林 白城 137001
- 折叠
摘要
Abstract
The reliability requirements for detector assembly have increased significantly with the development of infrared detector technology.Traditional methods of assessing detector reliability along with the entire system are insufficient to meet these requirements.To address this issue,this paper investigates the reliability verification of a 640×512(25 μm)mid-wave infrared detector module under environmental stress.Key components of the detector were subjected to high-temperature accelerated life tests and continuous operation tests.The overall reliability of the detector module was estimated based on the specialized reliability test data of critical components.The evaluation results,using selected reliability assessment methods,indicate that the developed module meets the reliability standards.The reliability verification and assessment methods used in this study provide an objective and accurate evaluation of the cooled infrared detector module.关键词
红外焦平面探测器/可靠性/可靠性试验Key words
infrared focal plane detector/reliability/reliability test分类
电子信息工程引用本文复制引用
宋宏伟,刘塑,李海英,于洪有,史圣兵,郭秀丽,李昊岚,张亚平,王向前..中波红外640×512(25μm)探测器组件可靠性验证试验[J].红外技术,2024,46(8):879-882,4.
