计算力学学报2024，Vol.41Issue(4)：795-800,6.DOI:10.7511/jslx20221204002
基于近场动力学的材料热力耦合损伤行为分析
Thermal-mechanical coupling damage behavior of material based on peridynamics
摘要
Abstract
In order to study the damage behavior of materials under thermal loading,a two-parameter bond-based peridynamics thermal-mechanical coupling model is proposed and the fracture criterion of the bond is given in this paper.This model includes the relationship of the bond's tangential deformation with the temperature.Compared with the bond-based peridynamics thermal-mechanical coupling model,the materials without a fixed Poisson's ratio are considered in this model,so that this model can be applied to study the effects of Poisson's ratio on damage behavior of materials under thermal loading.The damage behavior simulation of a ceramic plate under thermal shock loading is carried out,which shows that the crack initiation and propagation patterns obtained by this model are in agreement with the experimental results.Further researches on the influence of Poisson's ratio on material damage behavior show that,increasing Poisson's ratio results in earlier initiation of cracks,growth of the crack spacing and increase of the leading crack length,which indicates that the Poisson's ratio significantly influences the material damage behavior under thermal loading.关键词
键型近场动力学/热力耦合/泊松比/陶瓷/裂纹Key words
bond-based peridynamics/thermal-mechanical coupling/Poisson's ratio/ceramic/crack分类
数理科学引用本文复制引用
邵滨,姜翠香,曾金宝..基于近场动力学的材料热力耦合损伤行为分析[J].计算力学学报,2024,41(4):795-800,6.基金项目
省部共建耐火材料与冶金国家重点实验室基金(武汉科技大学)(G201407)资助项目. （武汉科技大学）
