制冷学报2024，Vol.45Issue(4)：85-92,8.DOI:10.3969/j.issn.0253-4339.2024.04.085
电子芯片弹热制冷式热控系统的数值模拟
Numerical Simulation of Elastocaloric Cooling Thermal Control System for Electronic Chips
摘要
Abstract
The rapid development of the electronic industry has led to a sharp increase in the heat flux of electronic equipment.The search for efficient cooling methods can significantly reduce the operating temperature of devices,improve their performance,and extend their lifespan.To further reduce the maximum operating temperature of chips,this study proposes a thermal control method for an electronic chip using the elastocaloric effect in shape memory alloys.The cold energy generated during unloading was transferred through the fluid to the microchannel heat sink thermal control system of the electronic chip with good heat dissipation performance.The temperature variation characteristics of the system under three-dimensional conditions were analyzed using FLUENT software.The results showed that the heat transfer fluid after refrigeration could reduce the highest temperature of the chip by 5.5 K,and the performance of the microchannel heat sink was improved by approximately 10.7％.Parametric analysis shows that an increase in the cycle frequency and accumulated flow rate of cooling liquid can significantly improve the cooling capacity of the refrigeration system,with cycle frequencies of 0.25 Hz and 0.33 Hz improving the cooling power by 68％and 92％,respectively.关键词
散热/弹热效应/微通道散热器/制冷系统/制冷能力Key words
heat dissipation/elastocaloric effect/microchannel heat sink/refrigerating system/cooling power引用本文复制引用
赵志明,刘奇,蒋翔俊,董兴琨,邹吾松,张笑凡..电子芯片弹热制冷式热控系统的数值模拟[J].制冷学报,2024,45(4):85-92,8.基金项目
国家自然科学基金(51775406)资助项目.(The project was supported by the National Natural Science Foundation of China(No.51775406).) 本文受陕西省自然科学基金(2023-JC-ZD-29、2022JQ-561)项目资助.(The project was supported by the Natural Sci-ence Foundation of Shaanxi Province(No.2023-JC-ZD-29 & No.2022JQ-561).) （51775406）
