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电子芯片弹热制冷式热控系统的数值模拟OA北大核心CSTPCD

Numerical Simulation of Elastocaloric Cooling Thermal Control System for Electronic Chips

中文摘要英文摘要

电子行业的迅猛发展使电子设备的热流密度急剧攀升.高效的散热方法,能够显著降低设备的工作温度,提升其性能并延长使用寿命.为进一步降低芯片的最高使用温度,提出一种基于形状记忆合金(SMA)弹热效应的电子芯片热控方法,即将卸载过程中产生的冷能通过流体介质输送至具有良好散热性能的电子芯片微通道散热器热控系统中.利用FLUENT软件,分析三维条件下系统的传热特性.结果表明:冷却后的传热流体进一步降低芯片的最高温度达5.5 K,微通道散热器性能提高约10.7%.经参数分析发现,提高制冷系统的循环频率和冷却液体积流量可以显著提高其制冷能力,循环频率为0.25 Hz和0.33 Hz时分别可提高68%和92%.

The rapid development of the electronic industry has led to a sharp increase in the heat flux of electronic equipment.The search for efficient cooling methods can significantly reduce the operating temperature of devices,improve their performance,and extend their lifespan.To further reduce the maximum operating temperature of chips,this study proposes a thermal control method for an electronic chip using the elastocaloric effect in shape memory alloys.The cold energy generated during unloading was transferred through the fluid to the microchannel heat sink thermal control system of the electronic chip with good heat dissipation performance.The temperature variation characteristics of the system under three-dimensional conditions were analyzed using FLUENT software.The results showed that the heat transfer fluid after refrigeration could reduce the highest temperature of the chip by 5.5 K,and the performance of the microchannel heat sink was improved by approximately 10.7%.Parametric analysis shows that an increase in the cycle frequency and accumulated flow rate of cooling liquid can significantly improve the cooling capacity of the refrigeration system,with cycle frequencies of 0.25 Hz and 0.33 Hz improving the cooling power by 68%and 92%,respectively.

赵志明;刘奇;蒋翔俊;董兴琨;邹吾松;张笑凡

陕西科技大学机电工程学院 西安 710021西安电子科技大学机电工程学院 西安 710071中国航空工业集团公司雷华电子技术研究所 无锡 641100

散热弹热效应微通道散热器制冷系统制冷能力

heat dissipationelastocaloric effectmicrochannel heat sinkrefrigerating systemcooling power

《制冷学报》 2024 (004)

85-92 / 8

国家自然科学基金(51775406)资助项目.(The project was supported by the National Natural Science Foundation of China(No.51775406).) 本文受陕西省自然科学基金(2023-JC-ZD-29、2022JQ-561)项目资助.(The project was supported by the Natural Sci-ence Foundation of Shaanxi Province(No.2023-JC-ZD-29 & No.2022JQ-561).)

10.3969/j.issn.0253-4339.2024.04.085

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