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NH3/N2复合热退火技术改善高浓度Mg掺杂GaN材料性能OA北大核心CSTPCD

Enhanced Properties of Heavily Mg-doped GaN by Combining Thermal Annealing Processes in NH3/N2

中文摘要英文摘要

研究了NH3/N2复合热退火技术对高浓度Mg掺杂GaN材料晶体质量、发光性质及导电性能的影响.实验结果表明,相较于传统N2氛围高温热退火后处理工艺而言,NH3氛围高温热退火后处理工艺可以改善高浓度Mg掺杂GaN材料的晶体质量,同时可以增进Mg受主原子的有效掺杂,使得其光致发光谱中蓝光峰强度增强.采用NH3氛围高温热退火结合N2氛围低温热退火后处理工艺复合技术制备得到的高浓度Mg掺杂GaN材料内部背景电子浓度显著降低.这是由于在NH3氛围高温热退火后处理工艺中,NH3的热分解产物能够有效降低材料内N空位和间隙Ga原子等浅施主型缺陷浓度,最终改善高浓度Mg掺杂GaN材料的导电性能.

The effect of a novel post-growth process,i.e.high-temperature thermal annealing process in NH3,on the crystal quality,luminescence property,and electrical conductivity of the heavily Mg-doped GaN was studied.The experimental results showed that,compared with the traditional high-temperature annealing process in N2,the high-temperature thermal annealing process in NH3 can improve crystal quality in the heavily Mg-doped GaN,while promote the further effective doping of Mg acceptors,resulting in an enhancement of the intensity of the blue luminescence band in its photoluminescence spectra.The heavily Mg-doped GaN with sig-nificantly lower background electron concentration was obtained by combining high-temperature thermal anneal-ing process in NH3 with low-temperature thermal annealing process in N2.This is because that the thermal de-composition products of NH3 in the post-growth process can effectively reduce the concentration of shallow do-nor-type defects such as N vacancies and interstitial Ga atoms in the material,ultimately improving electrical conductivity of the heavily Mg-doped GaN.

蒋宗霖;闫丹;张宁;魏同波;王军喜;魏学成

中国科学院半导体研究所宽禁带半导体研发中心,北京 100083||中国科学院大学材料科学与光电技术学院,北京 100049中国科学院半导体研究所宽禁带半导体研发中心,北京 100083

物理学

氮化镓Mg掺杂热退火工艺氨气

gallium nitrideMg dopedthermal annealingammonia

《发光学报》 2024 (008)

1325-1333 / 9

国家重点研发计划(2022YFF0705600);国家自然科学基金(62135013)Supported by National Key R&D Program of China(2022YFF0705600);National Natural Science Foundation of China(62135013)

10.37188/CJL.20240130

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