发光学报2024，Vol.45Issue(8)：1371-1379,9.DOI:10.37188/CJL.20240141
封装方式对垂直腔面发射激光器热特性的影响及优化
Thermal Analysis and Optimization of Vertical-cavity Surface-emitting Lasers with Different Packaging Structures
摘要
Abstract
Vertical-cavity surface-emitting laser (VCSEL) is easily integrated on-chip and is a key optoelectronic device in systems such as laser radar and security lighting.However,the severe self-heating phenomenon can affect the output power,high-speed characteristics,and stability of the devices.Therefore,thermal management technolo-gy is extremely important,and adopting an optimized packaging approach can effectively increase the heat dissipa-tion of VCSELs,which is an important method to improve VCSELs' thermal performance.This article is based on a finite element method (FEM) computational model to numerically analyze the thermal characteristics of VCSELs with different packaging methods and a thin copper layer covering the devices' surface.The simulation results indicate that compared to the top-emitting packaging method,the flip-chip packaging with substrate-emitting (fully etched top and bottom DBR) can effectively reduce the active region temperature,with a reduction rate exceeding 56％.As the device mesa diameter gradually increases,devices using the top-emitting packaging method show a decreasing trend in temperature and thermal resistance,with a temperature reduction 50 ℃ and the thermal resistance reduction of over 3.25 K/mW.However,devices with a fully etched top and bottom DBR structure using flip-chip packaging and devices with only etched P-DBR structure using flip-chip packaging both exhibit a slowly increasing trend in tempera-ture and thermal resistance,with temperature increases of 2 ℃ and thermal resistance increases of 0.15 K/mW.Cov-ering the device mesa,sidewalls,and substrate surfaces with a layer of copper can effectively reduce the temperature of the active region.When the thickness of the copper layer is 3 μm,the temperature reduction of the active region is 43％ and thermal resisitance reduction is 1.9 K/mW.This article analyzes the impact of packaging methods on the thermal characteristics of VCSELs and proposes optimization solutions,which have guiding significance for the effec-tive thermal packaging of VCSELs.关键词
垂直腔面发射激光器(VCSEL)/热特性/温度/热阻Key words
vertical-cavity surface-emitting laser(VCSEL)/thermal characteristics/temperature/thermal resistance分类
信息技术与安全科学引用本文复制引用
张玮,王延靖,佟海霞,王子烨,陆寰宇,王品尧,佟存柱..封装方式对垂直腔面发射激光器热特性的影响及优化[J].发光学报,2024,45(8):1371-1379,9.基金项目
国家重点研发计划(2023YFB3610800) （2023YFB3610800）
国家自然科学基金(62305330,62105329) （62305330,62105329）
吉林省自然科学基金(20240101330JC)Supported by the National Key R&D Program of China(2023YFB3610800) （20240101330JC）
National Natural Science Foundation of China(62305330,62105329) （62305330,62105329）
Jilin Provincial Natural Science Foundation(20240101330JC) （20240101330JC）
