计算机与数字工程2024，Vol.52Issue(6)：1650-1657,8.DOI:10.3969/j.issn.1672-9722.2024.06.010
基于移动GPU的芯片封装缺陷检测技术
Chip Packages Defect Detection Technology Based on Mobile GPU
摘要
Abstract
In order to ensure the quality of chip strips,manufacturers need to detect defects of chip packages.With the contin-uous improvement of production efficiency,it is urgent to design a multiple production lines detection method with low cost and high efficiency.Therefore,the defect detection technology based on mobile GPU is carried out,using the large number of parallel threads in GPU and assigning a single thread for each image to improve detection efficiency.Each thread uses image processing methods for feature analysis and detects different areas in image.Experimental results show that when detecting 50 production lines and each strip image has 10 areas to be detected,our method achieves a 15.02x speedup compared to the CPU detection method.关键词
芯片封装缺陷检测/移动GPU/检测效率/多路生产线检测/特征分析Key words
detect defects of chip packages/mobile GPU/detection efficiency/multiple production lines/feature analysis分类
信息技术与安全科学引用本文复制引用
陈阳,陈庆奎..基于移动GPU的芯片封装缺陷检测技术[J].计算机与数字工程,2024,52(6):1650-1657,8.基金项目
国家自然科学基金项目(编号:61572325,60970012) （编号:61572325,60970012）
高等学校博士学科点专项科研博导基金项目(编号:20113120110008) （编号:20113120110008）
上海重点科技攻关基金项目(编号:19DZ1208903) （编号:19DZ1208903）
上海市工程中心建设基金项目(编号:14511107902,16DZ1203603) （编号:14511107902,16DZ1203603）
上海市一流学科建设基金项目(编号:XTKX2012) （编号:XTKX2012）
沪江基金研究基地专项基金项目(编号:C14001)资助. （编号:C14001）
