Tree-Inspired Structurally Graded Aerogel with Synergistic Water,Salt,and Thermal Transport for High-Salinity Solar-Powered EvaporationOACSTPCDEI
Tree-Inspired Structurally Graded Aerogel with Synergistic Water,Salt,and Thermal Transport for High-Salinity Solar-Powered Evaporation
Xiaomeng Zhao;Heng Zhang;Kit-Ying Chan;Xinyue Huang;Yunfei Yang;Xi Shen
Department of Aeronautical and Aviation Engineering,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of ChinaDepartment of Aeronautical and Aviation Engineering,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of ChinaDepartment of Aeronautical and Aviation Engineering,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of China||Research Institute for Advanced Manufacturing,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of ChinaDepartment of Aeronautical and Aviation Engineering,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of ChinaDepartment of Aeronautical and Aviation Engineering,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of ChinaDepartment of Aeronautical and Aviation Engineering,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of China||Research Institute for Sports Science and Technology,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of China||Research Institute for Advanced Manufacturing,The Hong Kong Polytechnic University,Hung Hom,Kowloon,Hong Kong SAR,People's Republic of China
Composite aerogelGraded structureSolar-powered evaporationThermal insulationSalt rejection
Composite aerogelGraded structureSolar-powered evaporationThermal insulationSalt rejection
《纳微快报（英文）》 2024 (11)
19-37,19
This project was financially supported by the Research Grants Council of Hong Kong SAR(16200720),Environment and Conservation Fund of Hong Kong SAR(Project No.21/2022),Young Scientists Fund of National Natural Science Foundation of China(Grant No.52303106),Research Institute for Advanced Manufucturing(Project No.CD8R),and the start-up fund for new recruits of PolyU(Project Nos.P0038855 and P0038858).The authors appreciate the assistance from Prof.Jinglei Yang and Prof.Baoling Huang at HKUST in measuring thermal conductivity and emissivity and simulation.
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