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基于超声的高压电缆中间接头多层结构定位检测OA北大核心CSTPCD

Ultrasonic based multi-layer structure location detection of high-voltage cable intermediate joint

中文摘要英文摘要

采用相控阵技术可以检测高压电缆中间接头内部铅封缺陷,但此技术的成功应用是建立在接头结构清晰及铅封位置明确的基础上.由于高压电缆中间接头结构复杂,安装后无法确定铅封准确位置,导致缺陷识别困难、检出率低.为此,提出一种基于超声的高压电缆中间接头多层结构定位检测方法.首先,根据中间接头实物建立不同结构区域的模型;其次,利用Comsol仿真软件对尾管段、铅封边缘段和铅封段3个不同结构区域进行超声扫描分析;最后,对中间接头不同结构区域进行试验.经过对比分析可知,3.5 mm处出现明显绝缘密封胶回波,热缩管(防水胶带)回波出现在34.5 mm、22 mm和24 mm处,铅封(尾管)回波出现在36.5 mm、24 mm和26 mm处.试验结果表明,所提方法能快速直观地反映中间接头各层的结构信息,为高压电缆中间接头多层结构定位检测提供了一定的参考.

The phased array technology can be used to detect the seal defects in the intermediate joint of high-voltage cable,but the successful application of this technology is based on the clear structure of the joint and the clear position of the seal.Because of the complex structure of the intermediate joint,it is difficult to determine the exact position of the seal after installation,resulting in difficult identification of defects and low detection rate.On this basis,an ultrasonic based multi-layer structure location detection method for high-voltage cable intermediate joint is proposed.The models of different structural regions are established according to intermediate joints.Comsol simulation software is used to analyze three different structural regions of the liner section,seal edge section and seal section by the ultrasonic scanning.Different structural areas of the intermediate joint are tested.After comparative analysis,it can be seen that obvious insulation sealant echoes appear at 3.5 mm,heat shrink pipe(waterproof tape)echoes appear at 34.5 mm,22 mm and 24 mm,and lead seal(liner)echoes appear at 36.5 mm,24 mm and 26 mm.The experimental results show that the proposed method can reflect the structure information of each layer of the intermediate joint quickly and intuitively,and provide a certain reference for the multi-layer structure location detection of the high-voltage cable intermediate joint.

郭永玉;方春华;周固;刘家良;蔡树德

三峡大学 电气与新能源学院,湖北 宜昌 443000

电子信息工程

高压电缆中间接头多层结构定位检测Comsol仿真超声扫描

high-voltage cableintermediate jointmulti-layer structurelocation detectionComsol simulationultrasonic scanning

《现代电子技术》 2024 (018)

35-40 / 6

10.16652/j.issn.1004-373x.2024.18.006

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