重庆理工大学学报2024，Vol.38Issue(15)：1-19,19.DOI:10.3969/j.issn.1674-8425(z).2024.08.001
电子封装超声互连研究新进展
Research progress of microelectronic interconnection with ultrasonic in electronic packages
摘要
Abstract
Ultrasonic vibration and friction,local high temperature and high pressure by ultrasound energy help to achieve the low-temperature,fast and reliable interconnection of homogeneous and dissimilar materials.With the increasing demand for high-quality interconnection,ultrasonic technology has been widely applied in electronic packages.This paper reviews the research on ultrasonic solid-phase bonding such as ultrasonic wire bonding,direct ultrasonic bonding of block base material,and ultrasonic solid-phase bonding of base material/solder/base material.Reviews are also made on the research of ultrasonic liquid-phase bonding such as ultrasonic soldering and ultrasonic transient liquid phase bonding As well as ultrasonic bonding of solid-liquid mixtures such as ultrasonic nano-sintering and ultrasonic interconnections of hybrid (composite) solders.Although the parameters of high-frequency ultrasonic with high speed and low-power,and medium-frequency power ultrasonic with constant speed vary greatly,their principles and effects are similar.The quality and mechanism of interconnects are closely related to the contact material and its state.Due to the fast process,short time duration,narrow interconnect interface,and opacity joints in ultrasonic interconnects,real-time observation of liquid solder wetting flow,solder particles movement trajectory,delamination process of the base material and interface formation rules can be achieved by combining high-speed soldering imaging technology and synchronous X-ray imaging technology.The amplification of micro-solders size enables real-time measurement of the temperature effect and transient pressure of ultrasound by using temperature sensors and pressure sensors.Furthermore,this paper argues multi-ultrasound numerical simulation analysis is an effective means for researching the ultrasonic interconnect mechanism of micro-solders,considering the multiple factors influenced by dual ultrasound or multiple ultrasonic.关键词
电子封装/超声互连/同异质材料/高温高压/润湿流动Key words
electronic packaging/ultrasonic bonding/homogeneous and dissimilar materials/high temperature and high pressure/wetting and flowing分类
矿业与冶金引用本文复制引用
甘贵生,马勇冲,马鹏,江兆琪,李方樑,李乐奇,程大勇,徐向涛,夏大权..电子封装超声互连研究新进展[J].重庆理工大学学报,2024,38(15):1-19,19.基金项目
国家自然科学基金项目(62274020,61974013) （62274020,61974013）
中国博士后科学基金面上项目(2022MD713756) （2022MD713756）
重庆市教委科技项目重点重大项目(KJZD-K202101101) （KJZD-K202101101）
重庆市教委科技项目重大项目(KJZD-M202301102) （KJZD-M202301102）
