重庆理工大学学报2024，Vol.38Issue(15)：256-263,8.DOI:10.3969/j.issn.1674-8425(z).2024.08.030
考虑电磁-热-结构耦合的并沟线夹温升特性分析及验证
Temperature rise characterization and validation of parallel groove clamp considering electromagnetic-thermal-structural coupling
摘要
Abstract
To study the temperature rise characteristics of parallel groove clamps,this paper analyzes the actual distribution characteristics of the contact points between the wire and the parallel groove clamp and builds a three-dimensional electromagnetic,thermal,and structural multi physical field coupling model of the parallel groove clamps.Based on the structural field,the clamp and the wire installation and thermal expansion after the contact pressure of the wire are analyzed and the contact resistance is calculated.The current density and temperature distribution of the wire clamps are obtained by electromagnetic-thermal coupling,and the exact location of the highest temperature is investigated.Finally,the influence of different current carrying capacities and bolt looseness on the maximum temperature of the wire clamp is analyzed.Our results show when the current flows through the parallel groove clamp system,the current density of the wire and the clamp body contact point interface on the outside is the largest,causing the most serious heating.The smaller the current carrying capacity,the smaller the impact of bolt loosening on the maximum temperature of the clamp.Conversely,bolt loosening has a greater impact on the maximum temperature of the clamp.Finally,the accuracy of the simulation model is verified through temperature rise experiments,with an error within 3％.关键词
并沟线夹/接触点/接触电阻/多物理场/温度分布Key words
parallel groove clamp/contact point/contact resistance/multi-physics/temperature distribution分类
信息技术与安全科学引用本文复制引用
陈观慈,李军毅..考虑电磁-热-结构耦合的并沟线夹温升特性分析及验证[J].重庆理工大学学报,2024,38(15):256-263,8.基金项目
云南省科技厅科技计划项目(202104BN050011) （202104BN050011）
