科技创新与应用2024，Vol.14Issue(29)：72-76,5.DOI:10.19981/j.CN23-1581/G3.2024.29.015
大功率光电器件光波导键合技术研究
张晨璐 1罗燕 1魏紫东 1王乐庭 1谢雅 1尚吉扬1
作者信息
- 1. 上海航天电子通讯设备研究所,上海 201109
- 折叠
摘要
Abstract
The photoconductive semiconductor switches(PCSS)is a new type of semiconductor optoelectronic device,which is widely used in optical communication,radar,microwave and other fields,but surface breakdown will occur under the condition of high working voltage,so it is necessary to package it to improve the side voltage performance.In this paper,the silicon carbide wafer is encapsulated by optical waveguide,and the small area side hetero bonding is studied by glass paste sintering bonding,vacuum hot pressing bonding and optical waveguide glue bonding.Through the process optimization and bonding quality performance test of the three methods,the optical waveguide adhesive bonding method has the lowest loss of laser power,and the voltage withstand value of the device is improved to 10 kV.关键词
光导开关/玻璃浆料烧结/真空热压/光波导胶/键合方法Key words
photoconductive semiconductor switches(PCSS)/glass paste sintering/vacuum hot pressing/optical waveguide adhesive/bonding method分类
信息技术与安全科学引用本文复制引用
张晨璐,罗燕,魏紫东,王乐庭,谢雅,尚吉扬..大功率光电器件光波导键合技术研究[J].科技创新与应用,2024,14(29):72-76,5.
