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基于圆盘结构的管状IC芯片智能取放系统

许子康 刘志 吕志华 李双斌

现代信息科技2024,Vol.8Issue(17):13-18,6.
现代信息科技2024,Vol.8Issue(17):13-18,6.DOI:10.19850/j.cnki.2096-4706.2024.17.004

基于圆盘结构的管状IC芯片智能取放系统

Intelligent Pick and Place System of Tubular IC Chip Based on Disc Structure

许子康 1刘志 1吕志华 1李双斌1

作者信息

  • 1. 山东华宇工学院,山东 德州 253034
  • 折叠

摘要

Abstract

With the increasing types of IC chips,chip management has become an increasingly important issue.Traditional chip management methods often require a lot of manpower and time and are prone to errors,impacting production efficiency and product quality.This research aims to design an"Master of Chip Management"System—intelligent pick and place system of tubular IC chip based on disc structure,utilizing temperature and humidity sensors and infrared sensors,combined with Internet of Things technology to achieve real-time environmental monitoring within the system,to improve the pick and place efficiency and storage quality of IC chip.The system design,simulation verification and experimental verification methods are used to display the significant advantages of the system in improving production efficiency and quality.The results show that the system has the characteristics of high automation,rapid operation and strong reliability.

关键词

管状IC芯片/智能取放系统/电子制造/质量优化

Key words

tubular IC chip/intelligent pick and place system/electronic manufacturing/quality optimization

分类

信息技术与安全科学

引用本文复制引用

许子康,刘志,吕志华,李双斌..基于圆盘结构的管状IC芯片智能取放系统[J].现代信息科技,2024,8(17):13-18,6.

基金项目

2023年山东省大学生创新创业训练计划平台申报项目(S202313857028) (S202313857028)

现代信息科技

2096-4706

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