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面向车规级芯片产品的安全可靠性认证方案研究

刘玉莹 陈超 吴海文 夏显召 刘曦 岳岩

标准科学Issue(10):60-64,5.
标准科学Issue(10):60-64,5.DOI:10.3969/j.issn.1674-5698.2024.10.010

面向车规级芯片产品的安全可靠性认证方案研究

Research on Safety and Reliability Certification Scheme for Automotive-Grade Chip Products

刘玉莹 1陈超 1吴海文 2夏显召 3刘曦 2岳岩2

作者信息

  • 1. 中汽研华诚认证(天津)有限公司
  • 2. 国家市场监督管理总局认证认可研究中心
  • 3. 中汽研软件测评(天津)有限公司
  • 折叠

摘要

Abstract

With the continuous development trend towards intelligence,connectivity and electrification in automobiles,seventy percent of the core technologies in future automotive products will rely on chips for realization.Therefore,automotive chips are a crucial strategic focus for the development of China's automotive industry.On one hand,automotive chips have higher requirements compared to those used in consumer goods and industrial products,leading to not comprehensive industry maturity.On the other hand,due to the late start of China's automotive chip industry and insufficient progress in standards development,most automotive companies have a limited understanding of the technical requirements for chip products,resulting in difficulties in chip selection and an excessive reliance on foreign testing standards and results.Therefore,improving the domestic automotive chip certification system is a key element in addressing the challenges of the localization of industry.This paper,based on research and comparison of domestic and international data,provides an overview of the requirements for safety and reliability of automotive-grade chips,testing capabilities,and audit requirements.It also proposes a reliability certification review scheme for domestically adapted automotive-grade chip product testing and verification,aiming to provide reference for chip companies in product line planning and for vehicle manufacturers in design and selection.

关键词

智能驾驶/车规级芯片/可靠性认证/可靠性审查/芯片选型

Key words

intelligent driving/automotive-grade chips/reliability certification/reliability review/chip selection

引用本文复制引用

刘玉莹,陈超,吴海文,夏显召,刘曦,岳岩..面向车规级芯片产品的安全可靠性认证方案研究[J].标准科学,2024,(10):60-64,5.

基金项目

本文受市场监管总局技术保障专项"汽车芯片安全可靠性认证技术及通用审查方法研究"(项目编号:2023YJ38)资助. (项目编号:2023YJ38)

标准科学

1674-5698

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