具有紧凑结构的芯片声表面波拓扑延迟线设计与分析OA北大核心CSTPCD

Surface acoustic wave(SAW)delay lines have been widely utilized in modern RF signal processing,gyrometers,sensing,and particularly in the radar industry.They serve as core devices in radar systems such as spread-spectrum communication systems,electron-ic countermeasure systems,and multiphase modulation systems.Therefore,there is a pressing need for SAW delay lines with simple and compact structures.Nevertheless,in traditional electroacoustic interdigital transducer-based SAW delay lines,increasing the delay time can only be accomplished by either employing substrate materials with lower velocities or using multiple IDTs,which results in lower electromechanical coupling coefficients and a more complex device structure.Herein,an on-chip SAW delay line that exploits the ben-ding immunity characteristic of the topological protected edge state is proposed.Through folding the transmission path and modulating the velocity of the SAW,the delay line is capable of attaining a large delay time within a very compact structure.Under the same device volume and interdigital transducer configuration,the delay time is increased by more than 4 times compared with the traditional delay line,and can be further optimized.This surface acoustic wave topological delay line is compatible with Micro-Electro-Mechanical sys-tems(MEMS)processes,so,it can be easily integrated into MEMS devices and integrated circuits,clearing the path for the application of advanced artificial materials in integrated devices.