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金刚石化学机械抛光研究进展

安康 李成明 许光宇 吴海平 张亚琛 张永康 李利军 李鸿 张旭芳 刘峰斌

人工晶体学报2024,Vol.53Issue(10):1675-1687,13.
人工晶体学报2024,Vol.53Issue(10):1675-1687,13.

金刚石化学机械抛光研究进展

Research Progress in Chemical Mechanical Polishing of Diamond

安康 1李成明 2许光宇 1吴海平 1张亚琛 1张永康 1李利军 1李鸿 1张旭芳 3刘峰斌1

作者信息

  • 1. 北方工业大学机械与材料工程学院,北京 100144
  • 2. 北京科技大学新材料技术研究院,北京 100083
  • 3. 北方工业大学信息学院,北京 100144
  • 折叠

摘要

Abstract

Diamond plays a significant role in the fields of mechanics,optics,thermology and electronics(such as semiconductors)with its excellent properties.However,the surface quality of diamond affects its application in these areas.Therefore,obtaining high-quality surfaces through efficient polishing technology has always been a focus of diamond research.The main diamond polishing technologies include mechanical polishing,thermochemical polishing,laser polishing and chemical mechanical polishing,among which chemical mechanical polishing(CMP)has the advantages of low equipment operating costs,simple process,and minimal surface damage after polishing.Based on the analysis and comparison of the above polishing methods,this paper focuses on the field of CMP and makes a detailed comparison and analysis of its development history.Although the early CMP technology had certain limitations in process and polishing efficiency,it lays the foundation for the innovation and optimization of the subsequent technology;the application of H2O2 and its mixtures not only enhances the chemical reaction activity in the process of CMP and improves the material removal rate,but also effectively reduces the surface roughness and improves the surface quality of diamond;the photocatalytic assisted chemical mechanical polishing can enable diamond to achieve a high surface quality,but the equipment is relatively complicated and cannot meet the demand of mass production,which needs further research and optimization.In addition,this paper also predicts the future development of chemical mechanical polishing to provide reference for researchers in related fields.

关键词

金刚石/化学机械抛光/表面粗糙度/抛光液/去除机理

Key words

diamond/chemical mechanical polishing/surface roughness/polishing solution/removal mechanism

分类

数理科学

引用本文复制引用

安康,李成明,许光宇,吴海平,张亚琛,张永康,李利军,李鸿,张旭芳,刘峰斌..金刚石化学机械抛光研究进展[J].人工晶体学报,2024,53(10):1675-1687,13.

基金项目

国家自然科学基金区域联合基金项目(U23A2025) (U23A2025)

国家自然科学基金(52102034) (52102034)

北方工业大学组织科研基金(2023YZZKY12) (2023YZZKY12)

人工晶体学报

OA北大核心CSTPCD

1000-985X

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