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基于BSV的SM3算法硬件实现与优化

李可欣 韩跃平 聂怀昊

集成电路与嵌入式系统2024,Vol.24Issue(10):31-35,5.
集成电路与嵌入式系统2024,Vol.24Issue(10):31-35,5.DOI:10.20193/j.ices2097-4191.2024.0028

基于BSV的SM3算法硬件实现与优化

Hardware implementation and optimization of SM3 algorithm based on BSV

李可欣 1韩跃平 1聂怀昊1

作者信息

  • 1. 中北大学信息与通信工程学院,太原 030051
  • 折叠

摘要

Abstract

This article proposes an improved plan for the SM3 algorithm using the agile development language BSV.By analyzing the al-gorithm's operating logic,the algorithm is innovatively split into multiple high-abstraction BSV modules,thereby effectively reducing the design complexity and making it comparable to traditional Verilog design.The code amount is reduced by 60%compared to the previous model.The iterative compression module has a greater impact on the algorithm performance,thus methods such as parallel pipeline and single-round logic optimization are employed for improvement from two aspects,and simulation verification is conducted on the Xilinx ARTIX-7 series FPGA platform with successful serial port debugging.The final results show that only 1 563 LUT resources are con-sumed to achieve a throughput of 3.2 Gbit/s,which represents up to a threefold improvement in throughput per unit logic resource com-pared to existing solutions.The maximum operating frequency reaches 375 MHz,with a higher practical value.

关键词

SM3/敏捷开发/BSV/FPGA

Key words

SM3/agile development/BSV/FPGA

分类

信息技术与安全科学

引用本文复制引用

李可欣,韩跃平,聂怀昊..基于BSV的SM3算法硬件实现与优化[J].集成电路与嵌入式系统,2024,24(10):31-35,5.

集成电路与嵌入式系统

OACSTPCD

1009-623X

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