Process Optimization of Cu-en/AP Composite Microspheres Preparation by Electrostatic Spray Method Based on ANSYS SimulationOA北大核心CSTPCD

To investigate the process optimizationof Cu-en/AP composite microspheres preparation via electrostatic spraying,and to reveal the effects of droplet properties and flow rate variations on the experimental results during the electrostatic spraying process,the prepared process parameters of Cu-en/AP composite microspheres by electrostatic spray method under the orthogonal experimental design simulated by ANSYS(Fluent).The influence of flow rate,solvent ratio,and solid mass on the experimental results is examined using a controlled variable method.The results indicate that under the conditions of a flow rate of 2.67×10^(-3)kg/s an acetone-to-deionized water ratio of 1.5∶1.0,and a solid mass of 200 mg,the theoretical particle size of the composite microspheres can reach e nanoscale.Droplet trajectories in the electric field remain stable without significant deviation.The simulation results show that particle diameter decreases with increasing flow rate,with the trend leveling off around a flow rate of 1×10^(-3)kg/s.As the solvent ratio increases(with higher acetone content),particle diameter initially decreases,reaching a minimum around a ratio of 1.5∶1.0 before gradually increasing.Increasing the solid mass also reduces the particle diameter,with a linear increase in diameter observed at around 220 mg.Cu-en/AP composite microspheres with nanoscale dimensions were confirmed under these conditions by the final SEM images.