集成电路与嵌入式系统2024，Vol.24Issue(11)：29-40,12.DOI:10.20193/j.ices2097-4191.2024.0038
视觉SLAM机器人中光束法平差优化芯片研究综述
A survey of bundle adjustment optimization chips in visual SLAM robots
摘要
Abstract
In Visual Simultaneous Localization and Mapping(V-SLAM)systems,Bundle Adjustment(BA)plays a crucial role in opti-mizing camera parameters and the positions of 3D points.However,due to the high computational complexity and real-time require-ments of BA,traditional computing platforms struggle to meet efficiency demands.Recently,the introduction of dedicated hardware ac-celerators has provided new solutions for BA optimization.This paper reviews the current status of research and development trends in BA optimization-specific chips.It covers the application scenarios,definitions,and basic principles of BA algorithms;the acceleration of BA on Field-Programmable Gate Arrays(FPGA),Application-Specific Integrated Circuits(ASIC),and Graphics Processing Units(GPU),as well as the development trends of these accelerators.Furthermore,this paper discusses the technical challenges in imple-menting BA accelerators and anticipates future development directions.By summarizing current research advancements,this review aims to provide guidance and insights for future studies on BA optimization-specific chips.关键词
机器人芯片/同时定位与地图构建/光束法平差/硬件加速/专用芯片Key words
robot chips/simultaneous localization and mapping/bundle adjustment/hardware accelerator/application specific integrated circuits分类
信息技术与安全科学引用本文复制引用
莫霄睿,张惟宜,年成,郭与时,牛丽婷,张柏雯,张春..视觉SLAM机器人中光束法平差优化芯片研究综述[J].集成电路与嵌入式系统,2024,24(11):29-40,12.基金项目
国家自然科学基金(No.U20A20220) （No.U20A20220）
北京市科学技术研究财政资助项目(24CB012-01). （24CB012-01）
