低共熔溶剂对光伏板上Ag的浸出实验研究OA

By using a low eutectic solvent(DES)to efficiently dissolve the silver on the silicon wafers of photovoltaic panels,it makes it easier to recycle.The glass transition of DES solution was characterized by differential scanning calorimeter(DSC),and the hydrogen bond on DES solvent was characterized by fourier infrared spectroscopy(FTIR),and the formation mechanism of DES solution was analyzed.The silver content of silicon wafers before and after the reaction was measured by inductively coupled plasma atomic emission spectrometer(ICP)to obtain the leaching rate of the reaction.Under the reaction conditions of 80℃,60 min,350 r/min and solid-liquid ratio 1∶45(g∶ml),DES solution with molar ratio 1∶3(ferric chloride hexahydrate:urea)was used to react with silicon wafers.The leaching rate was 99.31%,and the reaction effect was good.With other conditions unchanged,single-factor experiments were conducted to study the effects of reaction time,reaction temperature and reaction solid-liquid ratio on silver leaching rate.The optimal reaction temperature was 60℃,the optimal reaction time was 40 min,and the optimal reaction solid-liquid ratio was 1∶10(g∶ml),the configured DES solvent has a good reaction effect on silver on silicon wafers of photovoltaic panels under different reaction parameters set.Among them,the effect of reaction conditions on the leaching rate is reaction temperature>reaction time>reaction solid-liquid ratio.